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Enhancing thermal conductivity of silicone rubber composites by in-situ constructing SiC networks: A finite-element study based on first principles calculation

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Abstract

Polymer composites as thermal interface materials have been widely used in modern electronic equipment. In this work, we report a novel method to prepare highly through-plane thermally conductive silicone rubber (SR) composites with vertically aligned silicon carbide fibers (VA-SiCFs) entangled by SiC nanowires (SiCNWs) networks. First, a series of carbon fibers (CFs) skeletons were fabricated in sequence of coating poor thermally conductive polyacrylonitrile-based CFs with polydopamine, ice-templated assembly, and freeze-drying processes. Furthermore, VA-SiCFs networks, i.e., long-range continuous SiCFs-SiCNWs networks, based on the prepared CFs skeletons, were in-situ obtained via template-assisted chemical vapor deposition method. The thermal conductivity enhancement mechanism of VA-SiCFs networks on its SR composites was also intensively studied by finite element simulation, based on the first principles investigation of SiC, and Foygel’s theory. The in-situ grown VA-SiCFs networks possess high intrinsic thermal conductivity without the thermal interface between fillers, acting as the high-efficiency through-plane long-range continuous thermal conduction path, in which the SiCNWs were the in-plane “thermal spreader”. The VA-SiCFs/SR composites reached a high through-plane thermal conductivity, 2.13 W/(m·K), at the filler loading of 15 vol.%, which is 868.2%, and 249.2% higher than that of pure SR sample, and random-CFs@polydopamine (PDA)/SR composites at the same content, respectively. The VA-SiCFs/SR composites also exhibited good electrical insulation performance and excellent dimensional stability, which guaranteed the stable interfacial heat transfer of high-power density electronic devices.

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Acknowledgements

The authors gratefully acknowledge the financial support of this work by the National Natural Science Foundation of China (Nos. 21978240, 52003219, and 52006057), Youth project of basic research program of Natural Science in Shaanxi Province (No. 2020JQ-179), the Fundamental Research Funds for the Central Universities (Nos. 3102018AX004, 3102017jc01001, and 531119200237), Shenzhen Xuni University Lab Construction Funding (No. YFJGJS1.0, 20191024213117281), Guangdong Province Key Field R&D Project (No. 2020B010178001), the student innovation fund of Northwestern Polytechnical University (No. 202110699234), the Open Testing Foundation of the Analytical & Testing Center of Northwestern Polytechnical University (No. 2020T020), and the Innovation Foundation for Doctor Dissertation of Northwestern Polytechnical University (No. CX2022072). The authors also acknowledge National Supercomputer Center in Guangzhou for providing COMSOL Multiphysics 5.5 HPC resources that have contributed to the research results reported within this paper.

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Authors and Affiliations

  1. School of Chemistry and Chemical Engineering, Shaanxi Key Laboratory of Macromolecular Science and Technology, Key Laboratory of Special Functional and Smart Polymer Materials of Ministry of Industry and Information Technology, Northwestern Polytechnical University, Xi’an, 710072, China

    Dongliang Ding, Shiyu Zhang, Haoyu Liang, Xu Wang, Ya Wu, Qiuyu Zhang & Yanhui Chen

  2. Shenzhen Research Institute of Northwestern Polytechnical University, Shenzhen, 518057, China

    Dongliang Ding, Shiyu Zhang, Xu Wang, Zhenguo Liu, Qiuyu Zhang & Yanhui Chen

  3. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, China

    Guangzhao Qin

  4. Queen Mary University of London Engineering School, Northwestern Polytechnical University, Xi’an, 710072, China

    Yuanming Ye

  5. Institute of Flexible Electronics, Northwestern Polytechnical University, Xi’an, 710072, China

    Zhenguo Liu

  6. Ningbo Institute of Northwestern Polytechnical University, Ningbo, 315103, China

    Zhenguo Liu

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  1. Dongliang Ding
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Enhancing thermal conductivity of silicone rubber composites by in-situ constructing SiC networks: A finite-element study based on first principles calculation

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Ding, D., Zhang, S., Liang, H. et al. Enhancing thermal conductivity of silicone rubber composites by in-situ constructing SiC networks: A finite-element study based on first principles calculation. Nano Res. 16, 1430–1440 (2023). https://doi.org/10.1007/s12274-022-4639-1

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