Abstract
An oblique angle electron beam co-deposition technique was used to fabricate nanostructured Sn-based thin films: Sn, Cu–Sn and Cu–Sn–C. The morphological and structural properties of the films were observed via scanning electron microscopy (SEM) and thin film X-ray diffraction (XRD) methods. The electrochemical (CV and EIS) and the galvanostatic test results demonstrated that the addition of Cu with or without C affected the electrochemical performance of the thin film positively since Cu and C improved both the mechanical and the electrical properties of the nanostructured Sn thin film electrode. The high cycleability and capacity retention were achieved when the nanostructured Cu–Sn–C thin film was used as an anode material since C increased the mechanical tolerance of the thin film to the volume expansion due to its grain refiner effect. Cu not only improved the electrical conductivity and the adhesion of the film to substrate but also the mechanical tolerance of the film with its ductile property.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Belt J R, Ho C D, Motloch C G, Miller T J and Duong T Q 2003 J. Power Sources 123 241
Besenhard J O, Komenda P, Paxinos A, Wudy E and Josowicz M 1986 Solid State Ionics 18–19 823
Besenhard J O, Yang J and Winter M 1997 J. Power Sources 68 87
Chen C K, Zhang X F and Cui Y 2008 Nano Lett. 8 307
Derrien G, Hassoun J, Panero S and Scrosati B 2007 Adv. Mater. 19 2336
Jung H R and Lee W J 2011 J. Electrochem. Soc. 158(A) 644
Kamali A R and Fray D J 2011 Recent Adv. Mater. Sci. 27 14
Kawakami S and Asao M 2005 US Patent Application 6 949 312
Kepler K D, Vaughey J T and Thackeray M M 1999 Electrochem. Solid-State Lett. 2 307
Lee K 2007 Synthesis of Si nanowires for an anode material of Li batteries, Ph.D Thesis (Korea: Pohang University of Science and Technology) p 13
Li H, Shi L H, Wang Q, Chen L Q and Huang X J 2002, Solid State Ionics 148, 247.
Lindsay M J, Wang G X and Li H K 2003 J. Power Sources 119 84
Mizutani S and Inoue H 2005 US Patent Application 0208378
Patzig C, Miessler A, Karabacak T and Rauschenbach B 2010 Phys. Status Solidi B 247 1310
Shin H-C and Liu M 2005 Adv. Finct. Mater. 15 582
Thackeray MM, Vaughey J T and Fransson LML 2005 JOM 54 20
Wang J, Ng S-H,Wexter D, Konstantinov K, Guo Z-P and Liu H-K 2006 Angew. Chem. Int. Ed. 45 6896
Wang F, Zhao M and Song X 2007 J. Alloys Compd. 439 249
Wachtler M, Besenhard J O and Winter M 2001 J. Power Sources 94 189
Zhang R, Upreti S and Whittingham M S 2011 J. Electrochem. Soc. 158 A1498
Acknowledgements
This work is a part of the research project 110M148 approved by The Scientific and Technological Research Council of Turkey (TUBİTAK). The research grant is gratefully acknowledged.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
POLAT, B.D., KELES, O. Improving electrochemical performance of tin-based anodes formed via oblique angle deposition method. Bull Mater Sci 37, 1701–1708 (2014). https://doi.org/10.1007/s12034-014-0735-5
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12034-014-0735-5