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The Passive Film Characteristics of Cold Deformed Pure Copper

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Abstract

In the present study, the effect of cold deformation on the electrochemical and passive behaviors of pure copper in 0.01 M NaOH solution was investigated. The dislocation density in cold deformation was calculated using a recently developed JAVA-based software, materials analysis using diffraction, based on Rietveld’s whole x-ray pattern fitting methodology. At the thickness reduction of 70%, the microhardness measured as 125.30 HV, which is 1.56 times than that in the annealed pure copper (80.25 HV). Potentiodynamic polarization plots and electrochemical impedance spectroscopy measurements showed that increasing the cold deformation offers better conditions for forming the passive films. In the Mott-Schottky analysis, no evidence for n-type behavior was obtained which indicates that the oxygen vacancies and the copper interstitials did not have any significant population density in the passive films. Also, this analysis revealed that with increasing cold deformation, the acceptor density of the passive films decreased.

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Authors and Affiliations

  1. Department of Materials Engineering, Bu-Ali Sina University, Hamedan, 65178-38695, Iran

    Arash Fattah-Alhosseini & Omid Imantalab

  2. Department of Materials Science and Engineering, Faculty of Engineering, Shahid Chamran University of Ahvaz, Ahvaz, Iran

    Majid Naseri

  3. School of Metallurgy and Materials Engineering, Iran University of Science and Technology (IUST), Tehran, Iran

    Davood Gholami

  4. Department of Mechanical Engineering, University of North Dakota, Grand Forks, ND, USA

    Meysam Haghshenas

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  1. Arash Fattah-Alhosseini
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Correspondence to Omid Imantalab.

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Fattah-Alhosseini, A., Naseri, M., Imantalab, O. et al. The Passive Film Characteristics of Cold Deformed Pure Copper. J. of Materi Eng and Perform 25, 4741–4749 (2016). https://doi.org/10.1007/s11665-016-2352-5

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  • DOI: https://doi.org/10.1007/s11665-016-2352-5

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