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The Influence of Thermal Conductivity of Die Material on the Efficiency of Hot-Stamping Process

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Abstract

To improve the production efficiency of the hot-stamping process from the perspective of the die materials, a numerical model of a B-pillar component was established to investigate the effects of the thermal conductivity of the die material on the cooling behavior, microstructure, and mechanical evolution of the formed component, as well as the temperature distribution of the die during the hot-stamping process. The results showed that the thermal conductivity of the die material has a more significant influence on the quenching stage than the forming stage. Under the specified simulation and boundary conditions, when the thermal conductivity of the die material improves by 76.23% at 25–300 °C, the maximum cooling rate of the component increases by 48.49% and consequently improves the quenching efficiency of the hot-stamping process by 31.82%. As the thermal conductivity of the die steel increases, the maximum temperature of the die decreases and its temperature uniformity improves. Moreover, to improve the efficiency of the hot-stamping process, steels that possess high thermal conductivity at low temperature ranges are favorable.

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Acknowledgments

This work is supported by National Natural Science Foundation of China (Grant Nos. 51401117 and 51171104) and Innovation Foundation of Shanghai University.

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Authors and Affiliations

  1. State Key Laboratory of Advanced Special Steel, Shanghai University, Shanghai, 200072, China

    Shuang Li, Luhai Zhou, Xiaochun Wu, Yun Zhang & Junwan Li

  2. Shanghai Key Laboratory of Advanced Ferrometallurgy, Shanghai University, Shanghai, 200072, China

    Shuang Li, Luhai Zhou, Xiaochun Wu, Yun Zhang & Junwan Li

  3. School of Materials Science and Engineering, Shanghai University, Shanghai, 200072, China

    Shuang Li, Luhai Zhou, Xiaochun Wu, Yun Zhang & Junwan Li

Authors
  1. Shuang Li
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  2. Luhai Zhou
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  3. Xiaochun Wu
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  5. Junwan Li
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Correspondence to Junwan Li.

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Li, S., Zhou, L., Wu, X. et al. The Influence of Thermal Conductivity of Die Material on the Efficiency of Hot-Stamping Process. J. of Materi Eng and Perform 25, 4848–4867 (2016). https://doi.org/10.1007/s11665-016-2332-9

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  • DOI: https://doi.org/10.1007/s11665-016-2332-9

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