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Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

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Abstract

The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents’ mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young’s modulus and hardness of the Cu6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young’s modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200°C.

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References

  1. X. Deng, N. Chawla, K.K. Chawla, and M. Koopman, Acta Mater. 52, 4291 (2004).

    Article  CAS  Google Scholar 

  2. X. Deng, M. Koopman, N. Chawla, and K.K. Chawla, Mater. Sci. Eng. A 364, 240 (2004).

    Article  Google Scholar 

  3. F. Gao and T. Takemoto, Mater. Lett. 60, 2315 (2006).

    Article  CAS  Google Scholar 

  4. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    Article  CAS  Google Scholar 

  5. J. Glazer, J. Electron. Mater. 23, 693 (1994).

    Article  CAS  Google Scholar 

  6. M. McCormack and S. Jin, JOM 45(7), 36 (1993).

    Article  CAS  Google Scholar 

  7. W.J. Plumbridge, J. Mater. Sci. 31, 2501 (1996).

    Article  CAS  Google Scholar 

  8. P. Vianco and D. Frear, JOM 45(7), 14 (1993).

    Article  CAS  Google Scholar 

  9. N. Chawla, Int. Mater. Rev. 54, 368 (2009).

    Article  CAS  Google Scholar 

  10. H. Zhiheng, L. Changqing, P. Conway, and R. Thomson, HDP ’04. Proceeding of the Sixth IEEE CPMT Conference, vol. 52 (2004).

  11. F. Gao, H. Nishikawa, T. Takemoto, and J. Qu, Microelectron. Reliab. 49, 296 (2009).

    Article  CAS  Google Scholar 

  12. R.R. Chromik, R.P. Vinci, S.L. Allen, and M.R. Notis, J. Mater. Res. 18, 2251 (2003).

    Article  CAS  Google Scholar 

  13. Y. Sun, J. Liang, Z.-H. Xu, G. Wang, and X. Li, J. Mater. Sci. Mater. Electron. 19, 514 (2007).

    Article  Google Scholar 

  14. P.-F. Yang, Y.-S. Lai, S.-R. Jian, J. Chen, and R.-S. Chen, Mater. Sci. Eng. A 485, 305 (2008).

    Article  Google Scholar 

  15. X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1403 (2003).

    Article  CAS  Google Scholar 

  16. W.C. Oliver and G.M. Pharr, J. Mater. Res. 7, 1564 (1992).

    Article  CAS  Google Scholar 

  17. J.C. Trenkle, C.E. Packard, and C.A. Schuh, Rev. Sci. Instrum. 81, 073901 (2010).

    Article  Google Scholar 

  18. F. Guo, S. Choi, J.P. Lucas, and K.N. Subramanian, J. Electron. Mater. 29, 1241 (2000).

    Article  CAS  Google Scholar 

  19. G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai, and J. Luo, J. Mater. Sci. Mater. Electron. 21, 421 (2010).

    Article  CAS  Google Scholar 

  20. L. Jiang and N. Chawla, Scripta Mater. 63, 480 (2010).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain

    S. Lotfian, J.M. Molina-Aldareguia & J. Llorca

  2. Department of Materials Science, Polytechnic University of Madrid, E.T.S. de Ingenieros de Caminos, 28040, Madrid, Spain

    J. Llorca

  3. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, 85287-6106, USA

    K.E. Yazzie & N. Chawla

Authors
  1. S. Lotfian
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  2. J.M. Molina-Aldareguia
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  3. K.E. Yazzie
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  4. J. Llorca
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  5. N. Chawla
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Correspondence to J.M. Molina-Aldareguia.

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Lotfian, S., Molina-Aldareguia, J., Yazzie, K. et al. Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation. J. Electron. Mater. 42, 1085–1091 (2013). https://doi.org/10.1007/s11664-013-2517-z

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  • DOI: https://doi.org/10.1007/s11664-013-2517-z

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