Skip to main content
Log in

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. S.P. Yu, H.J. Lin, and M.H. Hon, J. Mater. Sci.: Mater. Electron. 11, 461 (2000).

    Article  CAS  Google Scholar 

  2. F.A. El-Salam, R.H. Nada, and A.M.A. El-Khalek, Mater. Sci. Eng. A 448, 171 (2007).

    Article  Google Scholar 

  3. K. Suganuma and K.S. Kim, J. Mater. Sci.: Mater. Electron. 18, 121 (2007).

    Article  CAS  Google Scholar 

  4. R.A. Islam, Y.C. Chan, W. Jillek, and S. Islam, Microelectron. J. 37, 705 (2006).

    Article  CAS  Google Scholar 

  5. X. Chen, M. Li, X.X. Ren, A.M. Hu, and D.L. Mao, J. Electron. Mater. 35, 1734 (2006).

    Article  CAS  ADS  Google Scholar 

  6. C. Wei, Y.C. Liu, Y.J. Han, J.B. Wan, and K. Yang, J. Alloys Compd. 464, 301 (2008).

    Article  CAS  Google Scholar 

  7. K.L. Lin, K.I. Chen, H.M. Hsu, and C.L. Shi, Electronic Components and Technology Conference (2003), p. 658.

  8. H. Wang, H. Zhao, D.P. Sekulic, and Y. Qian, J. Electron. Mater. 37, 1640 (2008).

    Article  CAS  ADS  Google Scholar 

  9. J. Sylvestre and A. Blander, J. Electron. Mater. 37, 1618 (2008).

    Article  CAS  ADS  Google Scholar 

  10. M. McCormack, S. Jin, H.S. Chen, and D.A. Machusak, J.␣Electron. Mater. 23, 687 (1994).

    Article  CAS  ADS  Google Scholar 

  11. K.S. Kim, S.H. Huh, and K. Suganuma, J. Alloys Compd. 352, 226 (2003).

    Article  CAS  Google Scholar 

  12. M. McCormack, S. Jin, G.W. Kammlott, and H.S. Chen, Appl. Phys. Lett. 63, 15 (1993).

    Article  CAS  ADS  Google Scholar 

  13. C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).

    Article  CAS  ADS  Google Scholar 

  14. G. Montesperelli, M. Rapone, F. Nanni, P. Travaglia, P. Riani, R. Marazza, and G. Gusmano, Mater. Corr. 59, 662 (2008).

    Article  CAS  Google Scholar 

  15. M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994).

    Article  CAS  ADS  Google Scholar 

  16. I. Shohji, C. Gagg, and W.J. Plumbridge, J. Electron. Mater. 33, 923 (2004).

    Article  CAS  ADS  Google Scholar 

  17. A. Sharif and Y.C. Chan, Microelectron. Eng. 84, 328 (2007).

    Article  CAS  Google Scholar 

  18. J. Madeni, S. Liu, and T. Siewert, 2nd International Brazing and Soldering Conference (ISBC) (San Diego, California, 2003), February 17–19.

  19. J.T. Berry, AFS Trans. 78, 421 (1970).

    Google Scholar 

  20. P. Donelan, Mater. Sci. Technol. 16, 261 (2000).

    CAS  Google Scholar 

  21. J.M. Quaresma, C.A. Santos, and A. Garcia, Metall. Mater. Trans. A 31, 3167 (2000).

    Article  Google Scholar 

  22. W.R. Osório and A. Garcia, Mater. Sci. Eng. A 325, 103 (2002).

    Article  Google Scholar 

  23. W.R. Osório, C.A. Santos, J.M.V. Quaresma, and A. Garcia, J. Mater. Process. Technol. 143, 703 (2003).

    Article  Google Scholar 

  24. W.R. Osório, P.R. Goulart, G.A. Santos, C. Moura Neto, and A. Garcia, Metall. Mater. Trans. A 37, 2525 (2006).

    Article  Google Scholar 

  25. W.R. Osório, J.E. Spinelli, N. Cheung, and A. Garcia, Mater. Sci. Eng. A 420, 179 (2006).

    Article  Google Scholar 

  26. C.A. Siqueira, N. Cheung, and A. Garcia, Metall. Mater. Trans. A 33, 2107 (2002).

    Article  Google Scholar 

  27. W.R. Osório, C.S.C. Aoki, and A. Garcia, J. Power Sources 185, 1471 (2008).

    Article  Google Scholar 

  28. K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998).

    Article  CAS  ADS  Google Scholar 

  29. C.M.L. Wu, C.M.T. Law, D.Q. Yu, and L. Wang, J. Electron. Mater. 32, 63 (2003).

    Article  CAS  ADS  Google Scholar 

  30. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Mater. Sci. Eng. R 44, 1 (2004).

    Article  Google Scholar 

  31. T.C. Toye and E.R. Jones, Proc. Phys. Soc. 71, 88 (1957).

    Article  Google Scholar 

  32. S.C. Cheng and K.L. Lin, J. Electron. Mater. 31, 940 (2002).

    Article  CAS  ADS  Google Scholar 

  33. D.M. Rosa, J.E. Spinelli, I.L. Ferreira, and A. Garcia, Metall. Mater. Trans. A 39, 2161 (2008).

    Article  Google Scholar 

  34. X. Wei, H. Huang, L. Zhou, M. Zhang, and X. Liu, Mater. Lett. 61, 655 (2007).

    Article  CAS  Google Scholar 

  35. M.C. Flemings, Solidification Processing (New York: McGraw Hill, 1974).

    Google Scholar 

  36. L.R. Garcia, L.C. Peixoto, W.R. Osório, and A. Garcia, Mater. Lett. 63, 1314 (2009).

    Article  CAS  Google Scholar 

  37. S. Wiese and K. Wolter, Microelectron. Reliab. 44, 1923 (2004).

    Article  CAS  Google Scholar 

  38. Y.S. Kim, K.S. Kim, C.W. Hwang, and K. Suganuma, J.␣Alloys Compd. 352, 233 (2003).

    Google Scholar 

  39. J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, and K. Suganuma, J.␣Alloys Compd. 454, 310 (2008).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Amauri Garcia.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Garcia, L.R., Osório, W.R., Peixoto, L.C. et al. Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys. J. Electron. Mater. 38, 2405–2414 (2009). https://doi.org/10.1007/s11664-009-0888-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-009-0888-y

Keywords

Navigation