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Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints

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The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints of different sizes was investigated under quasistatic microtension loading. The experimental results show that the ultimate tensile strength of a joint does not always increase with decreasing thickness-to-diameter ratio (d/t), which is commonly regarded as the dominant factor for mechanical constraint in the joint. A clear joint volume effect on the strength has been found, i.e., the joint’s strength increases with decreasing joint volume \( \left( {V = {\frac{\pi }{4}}d^{2} t} \right), \) and the correlation follows an inverse proportional function reasonably well.

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Acknowledgements

This research was supported by the Ministry of Education, China, through the NCET (04-0824) and its matching grant, and the Alexander von Humboldt Foundation through a grant of resumption of fellowship to XPZ (1037365). C.L. acknowledges support from the Curtin Internal Research Grant.

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Authors and Affiliations

  1. School of Materials Science and Engineering, South China University of Technology, Guangzhou, 510640, China

    L.M. Yin & X.P. Zhang

  2. Department of Mechanical Engineering, Curtin University of Technology, Perth, WA, 6845, Australia

    Chunsheng Lu

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  1. L.M. Yin
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  2. X.P. Zhang
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  3. Chunsheng Lu
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Correspondence to X.P. Zhang.

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Yin, L., Zhang, X. & Lu, C. Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints. J. Electron. Mater. 38, 2179–2183 (2009). https://doi.org/10.1007/s11664-009-0858-4

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  • DOI: https://doi.org/10.1007/s11664-009-0858-4

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