Abstract
The Sn-Ag/CeO2 nanocomposite solders have been pulse electrodeposited from an aqueous citrate bath containing varying concentrations of CeO2 nanopowders (1 to 30 g/L). Microstructural characterization, hardness, melting point, electrical conductivity, wear resistance, and residual stress measurement of the composite coatings indicate that the composite deposited from an electrolyte containing 15 g/L CeO2 possesses the optimum properties and thus can have potential applications in solder joints and packaging.
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Sharma, A., Bhattacharya, S., Das, S. et al. Fabrication of Sn-Ag/CeO2 Electro-Composite Solder by Pulse Electrodeposition. Metall Mater Trans A 44, 5587–5601 (2013). https://doi.org/10.1007/s11661-013-1894-5
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DOI: https://doi.org/10.1007/s11661-013-1894-5