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Interfacial microstructure of CuCr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength

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Abstract

The CuCr/1Cr18Ni9Ti bi-metal materials were prepared by the solid-liquid bonding method. The microstructures, mechanical roperties and formation mechanism of the bonding interface were studied. The results show that there exists a serrated transition layer with a certain width at the interface of CuCr/1Cr18Ni9Ti bi-metal materials, and the transition layer consists of Fe-based and Cu-based solid solutions. The elastic modulus and hardness reach the maximum values at the interface closing to the 1Cr18Ni9Ti zone. The bonding temperature has a significant effect on the width and morphology of the transition layer. The interfacial bonding strength is at least 30% higher than that of the CuCr alloy, and the tensile fracture occurs at the side of the CuCr alloy rather than at the bonding interface.

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Authors and Affiliations

  1. Shaanxi Province Key Laboratory of Electrical Materials and Infiltration Technology, Xi’an University of Technology, Xi’an, 710048, China

    Qiao Zhang, ShuHua Liang, JunTao Zou & Qing Yang

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  1. Qiao Zhang
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  2. ShuHua Liang
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  3. JunTao Zou
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  4. Qing Yang
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Correspondence to ShuHua Liang.

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Zhang, Q., Liang, S., Zou, J. et al. Interfacial microstructure of CuCr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength. Sci. China Technol. Sci. 58, 825–831 (2015). https://doi.org/10.1007/s11431-015-5791-6

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  • DOI: https://doi.org/10.1007/s11431-015-5791-6

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