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Effect of poly(amic acid) and polyimide on the adhesive strength and fracture toughness of epoxy resin

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We investigate the effect of polyimide and poly(amic acid) contents on the properties of epoxy resin. Charpy impact strength increases by 80% and 70% with the addition of 10 wt.% poly(amic acid) and 15 wt.% polyimide, respectively. However, the flexural strength is improved by 95% and 73% (as compared with the neat epoxy resin) by the addition of 5 wt.% polyimide and 5 wt.% poly(amic acid), respectively. Moreover, the addition of 10 wt.% polyimide resulted in a twofold increase in the impact adhesive strength, while the tensile adhesive strength of the epoxy increases by 70% with only 5 wt.% polyimide. The infrared spectra show that the obtained compositions containing polyimide or poly(amic acid) exhibit semiinterpenetrating polymer network structures characterized by a relatively high flexibility and very good mechanical properties.

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References

  1. A. J. Kinloch and R. J. Young, Fracture Behavior of Polymers, Appl. Sci. Publishers, New York (1983).

    Google Scholar 

  2. J. L. Hedrick, I. Yilgor, G. L. Wilkes, and J. E. McGrath, “Chemical modification of matrix resin networks with engineering thermoplastics,” Polym. Bull., 13, No. 3, 201–208 (1985).

    Article  CAS  Google Scholar 

  3. C. B. Bucknal and I. K. Partridge, “Phase separation in epoxy resins containing polyethersulphone,” Polymer, 24, No. 5, 639–644 (1983).

    Article  Google Scholar 

  4. D. J. Hourston, J. M. Lane, and N. A. MacBeath, “Toughening of epoxy resins with thermoplastics II. Tetrafunctional epoxy-polyetherimide blends,” Polym. Intern., 26, No. 1, 17–21 (1991).

    Article  CAS  Google Scholar 

  5. M. Rong and H. Zeng, “Polycarbonate-epoxy semi-interpenetrating polymer network 2. Phase separation and morphology,” Polymer, 38, No. 2, 269–277 (1997).

    Article  CAS  Google Scholar 

  6. S. Kim, J. Kim, S. H. Lim, W. H. Jo, and C. R. Choe, “Effects of mixing temperatures on the morphology and toughness of epoxy/polyamide blends,” J. Appl. Polym. Sci,, 72, No. 8, 1055–1063 (1999).

    Article  CAS  Google Scholar 

  7. T. Agag and T. Takeichi, “Synthesis and characterization of epoxy film cured with reactive polyimide,” Polymer, 40, No. 23, 6557– 6563 (1999).

    Article  CAS  Google Scholar 

  8. K. Gaw, M. Kikei, M.-A. Kakimoto, and Y. Imai, “Preparation of polyimide epoxy composites,” Reactive & Functional Polymers,, 30, No. 1, 85–91 (1996).

    Article  CAS  Google Scholar 

  9. S. Li, B.-L. Hsu, F. Li, et al., “A study of polyimide thermoplastics used as tougheners in epoxy resins—structure, property, and solubility relationships,” Thermochim. Acta, 340–341, 221–229 (1999).

    Article  Google Scholar 

  10. F.-L. Jin and S.-J. Park, “Thermal properties and toughness performance of hyperbranched-polyimide-modified epoxy resins,” J. Polym. Sci., Part B. Polym.-Phys., 44, No. 23, 3348–3356 (2006).

    Article  CAS  Google Scholar 

  11. J. Huang, Y. Xiao, K. Y. Mya, et al., “Thermomechanical properties of polyimide-epoxy nanocomposites from cubic silsesquioxane epoxides,” J. Mater. Chem., 14, No. 19, 2858–2863 (2004).

    Article  CAS  Google Scholar 

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Acknowledgements

The authors are deeply grateful to Mr. Marcin Kostrzewa for the preparation of the FTIR spectra.

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Correspondence to M. Bakar.

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Published in Fizyko-Khimichna Mekhanika Materialiv, Vol.47, No.3, pp.77–83, May–June, 2011.

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Bakar, M., Okulska-Bożek, M. & Zygmunt, M. Effect of poly(amic acid) and polyimide on the adhesive strength and fracture toughness of epoxy resin. Mater Sci 47, 355–362 (2011). https://doi.org/10.1007/s11003-011-9403-8

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  • DOI: https://doi.org/10.1007/s11003-011-9403-8

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