Abstract
Polyurethane composites containing spherical and flake-shaped silver fillers of micrometer and nanometer sizes were prepared by reacting suspensions of the silver filler in tetraethylene glycol with Desmodur® HL BA. Both the thermal conductivity and the stability of the silver composites are increased in comparison with a reference polyurethane sample without filler. Unexpectedly, the largest increases in thermal conductivity and stability are observed for the spherical silver particles of micrometer size but not for the silver nanoparticles, which is reasoned with larger aggregates of silver particles and a higher degree of crystallinity in the sample containing micrometer-sized silver particles.
Similar content being viewed by others
References
Luedtke A. Thermal management materials for high-performance applications. Adv Eng Mater. 2004;6(3):142–4.
Ong B, Chow SG, Tang E. Thermally enhanced, next-generation 3-D power packages: a heat-management solution. Adv Packaging. 2005;14(11):23–5.
Zweben C. Advances in composite materials for thermal management in electronic packaging. JOM. 1998;50(6):47–51.
Zweben C. High-performance thermal management materials. Adv Packaging. 2006;15(2):20–2.
Zweben CH. Advances in high-performance thermal management materials: a review. J Adv Mater. 2007;39(1):3–10.
Bulsara M, Celler G, White T, Standley B, Huff H. Roadmap requirements for emerging materials. Solid State Technol. 2006;49(1):34–8.
Fletcher LS. A review of thermal enhancement techniques for electronic systems. IEEE T Compon Hybr. 1990;13(4):1012–21.
Zweben C. Advanced thermal management materials for electronics and photonics. Adv Microelectron. 2010;37(4):14–9.
Saums D, Jarrett B, Mackie AC, Ross J. Thermal management materials choices for power semiconductors. Adv Microelectron. 2009;36(4):8–16.
Evans W, Prasher R, Fish J, Meakin P, Phelan P, Keblinski P. Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids. Int J Heat Mass Tran. 2008;51(5–6):1431–8.
Xingyi H, Pingkai J, Liyuan X. Ferroelectric polymer/silver nanocomposites with high dielectric constant and high thermal conductivity. Appl Phys Lett. 2009;95(24):242901.
Chou CW, Hsu SH, Chang H, Tseng SM, Lin HR. Enhanced thermal and mechanical properties and biostability of polyurethane containing silver nanoparticles. Polym Degrad Stabil. 2006;91(5):1017–24.
Kim JY. Amphiphilic polyurethane-co-polystyrene network films containing silver nanoparticles. J Ind Eng Chem. 2003;9(1):37–44.
Chen S, Sui J, Chen L. Positional assembly of hybrid polyurethane nanocomposites via incorporation of inorganic building blocks into organic polymer. Colloid Polym Sci. 2004;283(1):66–73.
Chou CW, Hsu SH, Wang PH. Biostability and biocompatibility of poly(ether)urethane containing gold or silver nanoparticles in a porcine model. J Biomed Mater Res A. 2008;84(3):785–94.
Dallas P, Sharma VK, Zboril R. Silver polymeric nanocomposites as advanced antimicrobial agents: classification, synthetic paths, applications, and perspectives. Adv Colloid Interfac. 2011;166(1–2):119–35.
Raja M, Shanmugharaj AM, Ryu SH, Subha J. Influence of metal nanoparticle decorated CNTs on polyurethane based electro active shape memory nanocomposite actuators. Mater Chem Phys. 2011;129(3):925–31.
Lin M-F, Tsen W-C, Shu Y-C, Chuang F-S. Effect of silicon and phosphorus on the degradation of polyurethanes. J Appl Polym Sci. 2001;79(5):881–99.
Hsu SH, Tseng HJ, Lin YC. The biocompatibility and antibacterial properties of waterborne polyurethane-silver nanocomposites. Biomater. 2010;31(26):6796–808.
S-h Hsu, Chou C-W. Enhanced biostability of polyurethane containing gold nanoparticles. Polym Degrad Stabil. 2004;85(1):675–80.
Hung HS, Hsu SH. Biological performances of poly(ether)urethane-silver nanocomposites. Nanotechnology. 2007;18(47):475101–10.
Petrie EM. Handbook of adhesives and sealants. 2nd ed. New York: McGraw-Hill; 2007.
Rwei S-P, Wang L. Synthesis and electrical, rheological and thermal characterization of conductive polyurethane. Colloid Polym Sci. 2007;285(12):1313–9.
Erickson K. Thermal decomposition mechanisms common to polyurethane, epoxy, poly(diallyl phthalate), polycarbonate and poly(phenylene sulfide). J Therm Anal Calorim. 2007;89(2):427–40.
Wang S, Liang R, Wang B, Zhang C. Dispersion and thermal conductivity of carbon nanotube composites. Carbon. 2009;47(1):53–7.
Sun Y, Sheng P, Di C, Jiao F, Xu W, Qiu D, Zhu D. Organic thermoelectric materials and devices based on p- and n-type poly(metal 1,1,2,2-ethenetetrathiolate)s. Adv Mater. 2012;24(7):932–7.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Iqbal, M., McCullough, M., Harris, A. et al. Thermal conductivity of polyurethane composites containing nanometer- and micrometer-sized silver particles. J Therm Anal Calorim 108, 933–938 (2012). https://doi.org/10.1007/s10973-012-2412-5
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10973-012-2412-5