Skip to main content
Log in

Analysis of the Possibilities of Providing High-Quality Mechanized Soldering

  • Published:
Journal of Engineering Physics and Thermophysics Aims and scope

We have analyzed the possibilities of optimizing the technological processes of convection, wave, and laser soldering by comparing experimental data with the results of mathematical modeling.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. N. F. Lashko and S. V. Lashko, Soldering of Metals [in Russian], 2nd edn., Mashinostroenie, Moscow (1967).

    Google Scholar 

  2. V. N. Shtennikov, Evaluation of the prospects of printed circuit boards, Pribory, No. 9, 43–45 (2008).

  3. A. I. Pekhovich and V. M. Zhidkikh, Calculations of the Thermal Regime of Solid Bodies [in Russian], Énergiya, Leningrad (1976).

    Google Scholar 

  4. G. Korn and T. Korn, Handbook of Mathematics [Russian translation], Nauka, Moscow (1974).

    Google Scholar 

  5. G. Manko, Soldering and Solders [Russian translation], Mashinostroenie, Moscow (1968).

    Google Scholar 

  6. V. N. Shtennikov, Problems of minimization of the time of contact and laser soldering, Nano-Mikrosist. Tekh., No. 2, 18–20 (2009).

  7. V. N. Shtennikov, Comparison of travelling and chamber ovens for convective soldering of electronic components, Sbork. Mashinostr. Priborostr., No. 7, 12–15 (2010).

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to V. N. Shtennikov.

Additional information

Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 88, No. 2, pp. 433–437, March–April, 2015.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Shtennikov, V.N. Analysis of the Possibilities of Providing High-Quality Mechanized Soldering. J Eng Phys Thermophy 88, 447–451 (2015). https://doi.org/10.1007/s10891-015-1209-3

Download citation

  • Received:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10891-015-1209-3

Keywords

Navigation