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Signal transfer via smart conductive networks for high temperature performing wearable electronics

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Abstract

High temperature performing textile conductive networks for wearable electronic applications are demonstrated. Different types of conductive yarns, namely steel, copper, and silver-coated were used as signal transmission tracks in order to configure the smart conductive network architecture. Conductive networks were formed between the layers of high temperature-resistant fabric substrates which of the following substrates most likely consist of reactively sputtered aluminum particles, polybenzimidazoles (PBI), aramid, and glass fibers. The specimens were constructed using welding and conventional sewing techniques and their operating characteristics in terms of high temperature resistance (limited flame spread, convective heat transfer, radiant heat) and electrical properties (conductivity and signal quality in data transfer) were determined. As a result of thermal tests, the excellent performances among conductive networks are attributed to steel and copper threads used as signal transmission line hidden in the interface among aluminum, 100 % aramid (nonwoven), and epoxy layer used as a substrate. The efficient exploitation of smart conductive networks will boost the viability of data transfer quality among wearable electronic components performing at high temperatures.

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Funding

This research work was supported by the Istanbul Technical University, BAP, grant number MYL2018-41093. Authors also would like to thank Kıvanç Group in Turkey for supplying materials and testing.

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Authors and Affiliations

  1. Faculty of Textile Technologies and Design, Istanbul Technical University, Gumussuyu, 34437, Istanbul, Turkey

    Ercan Karabulut

  2. Faculty of Mechanical Engineering, Istanbul Technical University, Gumussuyu-Beyoglu, 34437, Istanbul, Turkey

    Senem Kurşun Bahadır

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  1. Ercan Karabulut
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Correspondence to Senem Kurşun Bahadır.

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Karabulut, E., Kurşun Bahadır, S. Signal transfer via smart conductive networks for high temperature performing wearable electronics. J Mater Sci: Mater Electron 31, 15996–16007 (2020). https://doi.org/10.1007/s10854-020-04161-5

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