Skip to main content
SpringerLink
Log in

Recent advances on Sn–Cu solders with alloying elements: review

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Nowadays, a major concern of Sn–Cu based solder alloy today is focused on continuously improving the comprehensive properties of the solder joints formed between the solders and substrates. The key issues and improvements about Sn–Cu–X (X = Ni, rare earths, Zn, Co, Ga, In, Bi, secondary particles etc.) solder are outlined and evaluated in this paper which compared to Sn–Cu solder. It can be summarized that by adding appropriate amounts of certain alloying elements X to Sn–Cu solder, and it is possible to tailor the properties of the solder, such as the melting and solidification behaviors, wettability, microstructure, interfacial reactions and mechanical properties of the solder. The reliability issues related to the implementation of Sn–Cu–X solder in advanced electronics system are also introduced, which indicates that further development on the Sn–Cu–X solders are to be underway.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18

Similar content being viewed by others

References

  1. K. Suganuma, Curr. Opinion Solid State Mater. Sci. 5(1), 55–64 (2001)

    Article  CAS  Google Scholar 

  2. K. Tu, A. Gusak, M. Li, J. Appl. Phys. 93, 1335 (2003)

    Article  CAS  Google Scholar 

  3. N. Lee, Mater. Advan.Packaging. 181–218 (2008)

  4. K. Zeng, JOM J. Minerals Metals Mater. Soci. 61(6), 28 (2009)

    Google Scholar 

  5. K. Kim, S. Huh, K. Suganuma, J. Alloys Compd. 352(1–2), 226–236 (2003)

    Article  CAS  Google Scholar 

  6. S.S. Babu, Int. Mater. Rev. 54(6), 333–367 (2009)

    Article  CAS  Google Scholar 

  7. N. Chawla, Int. Mater. Rev. 54(6), 368–384 (2009)

    Article  CAS  Google Scholar 

  8. S.W. Chen, C.H. Wang, S.K. Lin, C.N. Chiu, J. Mater. Sci. Mater. Electron. 18(1–3), 19–37 (2007)

    CAS  Google Scholar 

  9. Q.Z. Cui, F. Gao, S. Mukherjee, Z.Y. Gu, Small 5(11), 1246–1257 (2009)

    Article  CAS  Google Scholar 

  10. Y.C. Lin, X. Chen, J. Adhes. Sci. Technol. 22(14), 1631–1657 (2008)

    Article  CAS  Google Scholar 

  11. H. Ma, J.C. Suhling, J. Mater. Sci. 44(5), 1141–1158 (2009)

    Article  CAS  Google Scholar 

  12. A. Micol, C. Martin, O. Dalverny, M. Mermet-Guyennet, M. Karama, Microelectron. Reliab. 49(6), 631–641 (2009)

    Article  CAS  Google Scholar 

  13. E. Suhir, Appl. Mech. Rev. 62(4), (2009)

  14. M.J. Yim, Y. Li, K.S. Moon, K.W. Paik, C.P. Wong, J. Adhes. Sci. Technol. 22(14), 1593–1630 (2008)

    Article  CAS  Google Scholar 

  15. L. Zhang, S.B. Xue, L.L. Gao, Z. Sheng, H. Ye, Z.X. Xiao, G. Zeng, Y. Chen, S.L. Yu, J. Mater. Sci.: Mater. Electro. 21(1), 1–15 (2010)

    Article  Google Scholar 

  16. L. Zhang, S.B. Xue, L.L. Gao, G. Zeng, Z. Sheng, Y. Chen, S.L. Yu, J. Mater. Sci.: Mater. Electro. 20(8), 685–694 (2009)

    Article  CAS  Google Scholar 

  17. C. Andersson, P. Sun, J. Liu, J. Alloys Compd. 457(1–2), 97–105 (2008)

    Article  CAS  Google Scholar 

  18. T. Nishimura, S. Suenaga, M. Ikeda, Forth Pacific Rim International Conference on Advanced Materials and Processing I, 1087–1090 (2001)

  19. T. El-Ashram, R. Shalaby, J. Elec. Materi. 34(2), 212–215 (2005)

    Article  CAS  Google Scholar 

  20. J. Hwang, Z. Guo, H. Koenigsmann, Soldering Surf. Mount Technol. 13(2), 7–13 (2001)

    Article  CAS  Google Scholar 

  21. C. Zou, Y. Gao, B. Yang, Q. Zhai, C. Andersson, J. Liu, Soldering Surf. Mount Technol. 21(2), 9–13 (2009)

    Article  CAS  Google Scholar 

  22. R.N. Chukka, S. Telu, B. NRMR, L. Chen, J. Mater. Sci.: Mater. Electron. 22(3), 281–285 (2011)

    Article  CAS  Google Scholar 

  23. N. Zhao, H. Ma, L. Wang, Soldering Surf. Mount Technol. 21(2), 19–23 (2009)

    Article  CAS  Google Scholar 

  24. C. Gourlay, K. Nogita, J. Read, A. Dahle, J. Elec. Materi. 39(1), 56–69 (2010)

    Article  CAS  Google Scholar 

  25. C. Gourlay, J. Read, K. Nogita, A. Dahle, J. Elec. Materi. 37(1), 51–60 (2008)

    Article  CAS  Google Scholar 

  26. V. Vuorinen, H. Yu, T. Laurila, J.K. Kivilahti, J. Elec. Materi. 37(6), 792–805 (2008)

    Article  CAS  Google Scholar 

  27. K.M. Martorano, M.A. Martorano, S.D. Brandi, J. Mater. Process. Tech. 209(6), 3089–3095 (2009)

    Article  CAS  Google Scholar 

  28. H. Wang, S.B. Xue, W.X. Chen, F. Zhao, J. Mater. Sci.: Mater. Electro. 20(12), 1239–1246 (2009)

    Article  CAS  Google Scholar 

  29. C. Kim, S. Kang, D. Baldwin, J. Appl. Phys. 104(3), 3537 (2008)

    Google Scholar 

  30. H. Zhao, D. Nalagatla, D. Sekulic, J. Elec. Materi. 38(2), 284–291 (2009)

    Article  CAS  Google Scholar 

  31. M. Arenas, M. He, V. Acoff, J. Elec. Materi. 35(7), 1530–1536 (2006)

    Article  CAS  Google Scholar 

  32. T. Matsumoto, K. Nogi, Ann. Rev. Mater. Res. 38, 251–273 (2008)

    Article  CAS  Google Scholar 

  33. M. Rizvi, C. Bailey, Y. Chan, H. Lu, J. Alloys Compd. 438(1–2), 116–121 (2007)

    Article  CAS  Google Scholar 

  34. M. Rizvi, C. Bailey, Y. Chan, H. Lu, 1st Electronics Systemintegration Technology Conference, 145–151 (2006)

  35. H. Wang, F. Wang, F. Gao, X. Ma, Y. Qian, J. Alloys Compd. 433(1–2), 302–305 (2007)

    Article  CAS  Google Scholar 

  36. S. Huh, K. Kim, K. Suganuma, Mater. Trans. 43(3), 239–245 (2002)

    Article  CAS  Google Scholar 

  37. C. Wu, D. Yu, C. Law, L. Wang, Mater. Sci. Eng. R 44(1), 1–44 (2004)

    Article  Google Scholar 

  38. H. Chang, S. Chen, D. Wong, H. Hsu, J. Mater. Res. 18(6), 1420–1428 (2003)

    Article  CAS  Google Scholar 

  39. J. Wang, S. Xue, Z. Han, S. Yu, Y. Chen, Y. Shi, H. Wang, J. Alloys Compd. 467(1–2), 219–226 (2009)

    Article  CAS  Google Scholar 

  40. Y. Shi, S. Xue, J. Wang, L. Gu, W. Gu, Hanjie Xuebao/Transa. China Welding Insti. 28(11), 73–77 (2007)

    CAS  Google Scholar 

  41. J.X. Wang, S.B. Xue, X. Huang, Z.J. Han, S.L. Yu, Transa. China Welding Insti. 28(1), 49–52 (2007)

    Google Scholar 

  42. F. Hung, T. Lui, L. Chen, N. He, J. Alloys Compd. 457(1–2), 171–176 (2008)

    Article  CAS  Google Scholar 

  43. H. Yu, V. Vuorinen, J. Kivilahti, IEEE Trans. Electron. Packaging Manuf. 30(4), 293 (2007)

    Article  CAS  Google Scholar 

  44. K. Nogita, Intermetallics 18(1), 145–149 (2010)

    Article  CAS  Google Scholar 

  45. C. Yu, J. Liu, H. Lu, P. Li, J. Chen, Intermetallics 15(11), 1471–1478 (2007)

    Article  CAS  Google Scholar 

  46. K. Nogita, T. Nishimura, Scripta Mater. 59(2), 191–194 (2008)

    Article  CAS  Google Scholar 

  47. E. Gouda, Euro. Phys. J. Appl. Phys. 48(2), 20902 (2009)

    Article  Google Scholar 

  48. M. Cho, S. Kang, D. Shih, H. Lee, J. Elec. Materi. 36(11), 1501–1509 (2007)

    Article  CAS  Google Scholar 

  49. F. Wang, X. Ma, Y. Qian, Scripta Mater. 53(6), 699–702 (2005)

    Article  CAS  Google Scholar 

  50. M. Dudek, R. Sidhu, N. Chawla, J. Minerals Metals Mater. Soci. 58(6), 57–62 (2006)

    CAS  Google Scholar 

  51. M. Dudek, R. Sidhu, N. Chawla, M. Renavikar, J. Elec. Materi. 35(12), 2088–2097 (2006)

    Article  CAS  Google Scholar 

  52. M. Dudek, N. Chawla, Intermetallics (2010). doi:10.1016/j.intermet.2010.01.028

  53. M.A. Dudek, N. Chawla, J. Elec. Materi. 38(2), 210–220 (2009)

    Article  CAS  Google Scholar 

  54. C. Wu, D. Yu, C. Law, L. Wang, J. Elec. Materi. 31(9), 928–932 (2002)

    Article  CAS  Google Scholar 

  55. M. Liu, A. Xian, J. Elec. Materi. 38(11), 2353–2361 (2009)

    Article  CAS  Google Scholar 

  56. J. Yoon, S. Kim, S. Jung, J. Alloys Compd. 391(1–2), 82–89 (2005)

    Article  CAS  Google Scholar 

  57. H. Nishikawa, J. Piao, T. Takemoto, J. Elec. Materi. 35(5), 1127–1132 (2006)

    Article  CAS  Google Scholar 

  58. G. Zeng, S.B. Xue, L. Zhang, L.L. Gao, W. Dai, J.D. Luo, J. Mater. Sci.: Mater. Electro. 21(5), 421–440 (2010)

    Article  CAS  Google Scholar 

  59. T. Laurila, V. Vuorinen, J. Kivilahti, Mater. Sci. Eng. R 49(1–2), 1–60 (2005)

    Article  Google Scholar 

  60. C.E. Ho, S.C. Yang, C.R. Kao, J. Mater. Sci.: Mater. Electro. 18(1–3), 155–174 (2007)

    CAS  Google Scholar 

  61. J. Jang, D. Frear, T. Lee, K. Tu, J. Appl. Phys. 88, 6359 (2000)

    Article  CAS  Google Scholar 

  62. M. He, A. Kumar, P. Yeo, G. Qi, Z. Chen, Thin Solid Films 462, 387–394 (2004)

    Article  Google Scholar 

  63. S. Chen, S. Wu, S. Lee, J. Elec. Materi. 32(11), 1188–1194 (2003)

    Article  Google Scholar 

  64. M. Islam, Y. Chan, Mater. Sci. Eng. B 117(3), 246–253 (2005)

    Article  Google Scholar 

  65. J. Yoon, S. Kim, J. Koo, D. Kim, S. Jung, J. Elec. Materi. 33(10), 1190–1199 (2004)

    Article  CAS  Google Scholar 

  66. Y. Huang, S. Chen, W. Gierlotka, C. Chang, J. Wu, J. Mater. Res. 22(10), 2924–2929 (2007)

    Article  CAS  Google Scholar 

  67. H. Tsukamoto, Z. Dong, H. Huang, T. Nishimura, K. Nogita, Mater. Sci. Eng. B 164(1), 44–50 (2009)

    Article  CAS  Google Scholar 

  68. M. Rizvi, C. Bailey, Y. Chan, M. Islam, H. Lu, J. Alloys Compd. 438(1–2), 122–128 (2007)

    Article  CAS  Google Scholar 

  69. K. Nogita, C. Gourlay, T. Nishimura, JOM J. Minerals Metals Mater. Soci. 61(6), 45–51 (2009)

    CAS  Google Scholar 

  70. W. Xiao, Y. Shi, G. Xu, R. Ren, F. Guo, Z. Xia, Y. Lei, J. Alloys Compd. 472(1–2), 198–202 (2009)

    Article  CAS  Google Scholar 

  71. D. Yu, J. Zhao, L. Wang, J. Alloys Compd. 376(1–2), 170–175 (2004)

    Article  CAS  Google Scholar 

  72. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, G. Zeng, F. Ji, J. Mater. Sci.: Mater. Electro. 21(7), 643–648 (2010)

    Article  CAS  Google Scholar 

  73. X. Ma, Y. Qian, F. Yoshida, J. Alloys Compd. 334(1–2), 224–227 (2002)

    Article  CAS  Google Scholar 

  74. C. Wu, Y. Wong, J. Mater. Sci.: Mater. Electro. 18(1), 77–91 (2007)

    Article  CAS  Google Scholar 

  75. K. Tu, Phys. Rev. B 49(3), 2030–2034 (1994)

    Article  CAS  Google Scholar 

  76. K. Tu, R. Thompson, Acta Metallurga 30(5), 947–952 (1982)

    Article  CAS  Google Scholar 

  77. J. Yoon, S. Kim, S. Jung, J. Alloys Compd. 385(1–2), 192–198 (2004)

    Article  CAS  Google Scholar 

  78. H. Lee, M. Chen, H. Jao, T. Liao, Mater. Sci. Eng. A 358(1–2), 134–141 (2003)

    Google Scholar 

  79. T. Laurila, V. Vuorinen, M. Paulasto-Krckel, Mater. Sci. Eng.: R: Rep 68(1–2), 1–38 (2010)

    Article  Google Scholar 

  80. J. Shen, Y. Liu, Y. Han, H. Gao, J. Mater. Sci.: Mater. Electro. 18(12), 1235–1238 (2007)

    Article  CAS  Google Scholar 

  81. Y. Gao, Z. Luo, J. Zhao, L. Wang (2009) Electronic Packaging Technology & High Density Packaging, 890–893 (2009)

  82. C. Wu, M. Huang, J. Elec. Materi. 31(5), 442–448 (2002)

    Article  CAS  Google Scholar 

  83. M. Kamal, T. El-Ashram, Mater. Sci. Eng. A 456(1–2), 1–4 (2007)

    Google Scholar 

  84. A. Sharif, Y. Chan, J. Alloys Compd. 390(1–2), 67–73 (2005)

    Article  CAS  Google Scholar 

  85. M. Alam, S. Nai, M. Gupta, J. Alloys Compd. 476(1–2), 199–206 (2009)

    Article  CAS  Google Scholar 

  86. X. Zhong, M. Gupta, J. Phys. D Appl. Phys. 41, 095403 (2008)

    Article  Google Scholar 

  87. G. Li, Y. Shi, H. Hao, Z. Xia, Y. Lei, F. Guo, J. Alloys Compd. 491(1–2), 382–385 (2010)

    Article  CAS  Google Scholar 

  88. M. Williams, K. Moon, W. Boettinger, D. Josell, A. Deal, J. Elec. Materi. 36(3), 214–219 (2007)

    Article  CAS  Google Scholar 

  89. E. Buchovecky, N. Du, A. Bower, Appl. Phys. Lett. 94, 191904 (2009)

    Article  Google Scholar 

  90. T. Fang, M. Osterman, M. Pecht, Microelectron. Reliab. 46(5–6), 846–849 (2006)

    Article  CAS  Google Scholar 

  91. L. Reinbold, N. Jadhav, E. Chason, K. Sharvan Kumar, J. Mater. Res. 24, 3583–3589 (2009)

    Article  CAS  Google Scholar 

  92. A. Wu, Y. Ding, Microelectron. Reliab. 49(3), 318–322 (2009)

    Article  Google Scholar 

  93. T. Chuang, H. Lin, C. Chi, Scripta Mater. 56(1), 45–48 (2007)

    Article  CAS  Google Scholar 

  94. T. Chuang, Scripta Mater. 55(11), 983–986 (2006)

    Article  CAS  Google Scholar 

  95. B. Jiang, A. Xian, Philosophical Magaz. Lett. 87(9), 657–662 (2007)

    Article  CAS  Google Scholar 

  96. C. Wei, C. Chen, P. Liu, C. Chen, J. Appl. Phys. 105, 023715 (2009)

    Article  Google Scholar 

  97. C. Chen, S. Chen, J. Appl. Phys. 90, 1208 (2001)

    Article  CAS  Google Scholar 

  98. K. Tu, J. Appl. Phys. 94, 5451 (2003)

    Article  CAS  Google Scholar 

  99. D. Živković, D. Minić, D. Manasijević, N. Talijan, I. Katayama, A. Kostov, J. Mater. Sci.: Mater. Electro. doi:10.1007/s10854-010-0272-y

Download references

Acknowledgments

The present work was carried out with the support of Nanjing University of Aeronautics and Astronautics Doctoral Dissertation Innovation and Excellence Producing foundation (Project No. BCXJ09-07); supported by the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan (Project No. CX07B_087z).

Author information

Authors and Affiliations

  1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 210016, Nanjing, People’s Republic of China

    Guang Zeng, Songbai Xue, Liang Zhang & Lili Gao

Authors
  1. Guang Zeng
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Songbai Xue
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Liang Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Lili Gao
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Songbai Xue.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zeng, G., Xue, S., Zhang, L. et al. Recent advances on Sn–Cu solders with alloying elements: review. J Mater Sci: Mater Electron 22, 565–578 (2011). https://doi.org/10.1007/s10854-011-0291-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-011-0291-3

Keywords

Search

Navigation