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Selective metallization on additive manufactured polymer for fabrication of integrated device

  • Polymers & biopolymers
  • Published:
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Abstract

Advanced electronic devices are supposed to highly integrated, such as wearable electronics, bioelectronics, and light-emitting diodes. The circuits are required to be fabricated compactly to the structure. This study proposed an approach to achieve close fabrication of circuit and structure. We used digital light processing additive manufacturing to rapidly form substrate structure, which is composed of ultraviolet-curable resin and Cu2(OH)PO4 particle. The substrate structure was then processed by laser activation and electroless plating metallization. As a result, the selective circuit can be fabricated on the surface of substrate structure. A series of characterizations were conducted using SEM, XPS, CLSM, and so on to investigate the morphology and analyze the surface chemistry of composite. After 5 min electroless copper plating, the resistivity of copper circuit on composite were 7.5 × 10−8 Ω·m. The obtained copper layer has good adhesion property (highest 5B level after adhesion test). This work provides an approach for complex structures of circuit and structure integrated devices, which has a potential application in advanced electronic devices.

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Acknowledgements

This work was supported by Jiangsu Provincial Key Research and Development Program (No. BE2019002) and the China Postdoctoral Science Foundation (Nos. 2020M671475, 2020M671455, 2020TQ0141). The authors also extend their science thanks to those who contributed in instructions and experiments work.

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Author notes

  1. Fuxi Liu and Deqiao Xie have contributed equally.

Authors and Affiliations

  1. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Fuxi Liu, Chen Jiao, Dezhi Bai, Haidong Wu, Lida Shen, Zongjun Tian & Jianfeng Zhao

  2. College of Energy and Powder Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Deqiao Xie

  3. National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, China

    Lida Shen, Zongjun Tian & Jianfeng Zhao

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  1. Fuxi Liu
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Correspondence to Jianfeng Zhao.

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Liu, F., Xie, D., Jiao, C. et al. Selective metallization on additive manufactured polymer for fabrication of integrated device. J Mater Sci 57, 1506–1515 (2022). https://doi.org/10.1007/s10853-021-06695-3

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