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Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions

  • EUROMAT 2009
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Abstract

Contact angles on copper substrate of Bi–Ag–Sn and Bi–Ag–Zn ternary alloys containing 3, 6, and 9 at.% of Sn and Zn, respectively, were studied with the sessile drop method. Wetting tests were carried out at 573 and 603 K with or without the use of a flux. Without the flux, the examined alloys do not wet copper, i.e., the observed contact angles are higher than 90°. However, in the presence of the flux wetting of copper is observed. In the case of alloys with Sn, the contact angles decrease with increasing content of Sn, while in the case of alloys with Zn no such tendency is observed. Solidified solder–substrate couples were cross-sectioned and examined with scanning electron microscopy coupled with electron dispersive X-ray analysis.

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Acknowledgements

This work is sponsored by the Ministry of Science and Higher Education of Poland in the years 2007–2010 under the framework of European Concerted Action on “Advanced Solder Materials for High Temperature Application (HISOLD)—COST MP0602.”

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Authors and Affiliations

  1. Institute of Metallurgy and Materials Science, Polish Academy of Sciences, 25 Reymonta St., 30-059, Krakow, Poland

    Przemysław Fima, Władysław Gąsior, Anna Sypień & Zbigniew Moser

  2. Center for High Temperature Studies, Foundry Research Institute, 73 Zakopianska St., 30-418, Krakow, Poland

    Przemysław Fima

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  1. Przemysław Fima
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  2. Władysław Gąsior
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  3. Anna Sypień
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  4. Zbigniew Moser
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Correspondence to Przemysław Fima.

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Fima, P., Gąsior, W., Sypień, A. et al. Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions. J Mater Sci 45, 4339–4344 (2010). https://doi.org/10.1007/s10853-010-4291-0

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  • DOI: https://doi.org/10.1007/s10853-010-4291-0

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