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Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering

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Abstract

The density and the surface tension of binary Sn–Sb and ternary Sn–Sb–Cu liquid alloys have been measured over a wide temperature range by the sessile-drop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of these alloys on the Cu and Ni substrates in a vacuum were also performed.

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Acknowledgements

This work was performed in the framework of the European Concerted Research Action COST MP0602 project: “Advanced Solder Materials for High Temperature Application”. The authors acknowledge the financial support of this work by the Deutscher Akademischer Austausch Dienst - German Academic Exchange Service (DAAD).

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Authors and Affiliations

  1. Department of Metal Physics, Ivan Franko National University, 79005, Lviv, Ukraine

    Yu. Plevachuk

  2. Institute of Physics, Chemnitz University of Technology, 09107, Chemnitz, Germany

    W. Hoyer & I. Kaban

  3. German Aerospace Center, Institute of Materials Physics in Space, 51170, Cologne, Germany

    M. Köhler

  4. Department of Genoa, CNR-IENI, Via de Marini, 6, 16149, Genoa, Italy

    R. Novakovic

Authors
  1. Yu. Plevachuk
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  2. W. Hoyer
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  3. I. Kaban
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  4. M. Köhler
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  5. R. Novakovic
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Correspondence to Yu. Plevachuk.

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Plevachuk, Y., Hoyer, W., Kaban, I. et al. Experimental study of density, surface tension, and contact angle of Sn–Sb-based alloys for high temperature soldering. J Mater Sci 45, 2051–2056 (2010). https://doi.org/10.1007/s10853-009-4120-5

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  • DOI: https://doi.org/10.1007/s10853-009-4120-5

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