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Ban, C., Cui, J., Han, Y. et al. Solidification behavior of Al–20.6%Cu alloy under AC magnetic field. J Mater Sci 41, 3113–3115 (2006). https://doi.org/10.1007/s10853-006-5243-6
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DOI: https://doi.org/10.1007/s10853-006-5243-6