Skip to main content

Advertisement

Log in

Phase change materials for advanced cooling packaging

  • Review
  • Published:
Environmental Chemistry Letters Aims and scope Submit manuscript

Abstract

Controlling the temperature of food packages during transport is needed with the rise of online shopping. During transport, food requires cold temperatures to maintain freshness. A major issue is the undesired warming of food when packages are exposed to warm temperatures on airport tarmacs and temporary unrefrigerated storage during air transportation. To solve this problem, phase change materials (PCMs) can maintain package temperature by changing their phase from liquid to solid or vice versa, to absorb or release latent heat. Although this technology is still not fully commercially viable yet, it has good potential. This article reviews all aspects of PCM packaging, including their classification, technical approaches, and commercial applications, with focus on the direct integration of PCM into food package systems. The article also provides guidelines for future research and reveals aspects that still hinder the full exploitation of PCM in the food packaging industry. To make PCM packaging commercially viable, research needs to consider aspects such as cost, consumer acceptance and confidence, regulatory aspects, e.g., labeling, and multifunctionality.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4

Similar content being viewed by others

References

Download references

Acknowledgements

This work was supported by the Korea Institute of Planning and Evaluation for Technology in Food, Agriculture, Forestry, and Fisheries (IPET) through the High Value-Added Food Technology Development Program, funded by the Ministry of Agriculture, Food, and Rural Affairs (MAFRA) (316067-3).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Youn Suk Lee.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Singh, S., Gaikwad, K.K. & Lee, Y.S. Phase change materials for advanced cooling packaging. Environ Chem Lett 16, 845–859 (2018). https://doi.org/10.1007/s10311-018-0726-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10311-018-0726-7

Keywords

Navigation