Abstract
Micro-electromechanical systems (MEMS) relays should have high current-carrying capability and high device reliability for high-power applications. The current-carrying capability of MEMS relays is mainly limited by the thickness of metal contacts fabricated by micromachining process. Another significant limiting factor is the high contact resistance resulted from the low driving force, which is provided by microactuators. This paper presents a matrix configuration of electrostatically actuated microcantilever relay arrays that are connected in parallel to shunt high currents to individual relay elements. This method allows the matrix to be configured for different power requirements. The proposed novel hollow suspended spring lowers the driving voltage and enhances the device stability considerably because of its low longitudinal stiffness while high lateral stiffness. The average of pull-in voltages is approximately 39.4 V and the overdamped switching-on time is approximately 180 μs when 42 V of driving voltage is applied. Contact resistance of each relay is less than 1 Ω, and the equivalent contact resistance of the 2 × 2 relay arrays is lower than 250 mΩ. Each relay can operate in over 6.5 × 103 hot-switching cycles without failing at a current of 20 mA with 0.3 μm thick Au contacts, thus the 2 × 2 relay arrays can carry four times currents more than one single relay. Therefore, the proposed MEMS relay arrays are suitable for applications in high-power switching systems that require high reliability and stability, such as space applications.
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References
Barillaro G, Molfese A, Nannini A, Pieri F (2005) Analysis, simulation and relative performances of two kinds of serpentine springs. J Micromech Microeng 15:736–746
Barker NS (1999) Distributed MEMS transmission lines. PhD Thesis, University of Michigan
Broue A, Fourcade T, Dhennin J, Courtade F, Charvet PL, Pons P, Lafontan X, Plana R (2010) Validation of bending tests by nanoindentation for micro-contact analysis of MEMS switches. J Micromech Microeng 20:085025
Chow LLW, Schrader SA (2006) Transition from multiple to single microcontact conduction during hot switching of microelectromechanical switches. J Appl Phys 89:33501
COMSOL (2015) Pull-in voltage for a biased resonator-3D. http://www.cn.comsol.com/model/download/227861/models.mems.biased_resonator_3d_pull_in.pdf
de Aragon AM (1998) Space applications of micro/nano-technologies. J Micromech Microeng 8:54–56
Delrio FW, de Boer MP, Knapp, JA, David reedy E Jr, Clews PJ, Dunn ML (2005) The role of van der waals forces in adhesion of micromachined surfaces. Nat Mater 4:629–634
Dragoi V, Lindner P, Glinsner T, Wimplinger M, Farrens S (2003) Advanced anodic bonding processes for MEMS applications. Mat Res Soc Symp Proc, vol 782, pp A5–80
Elata D, Bamberger H (2006) On the dynamic pull-in of electrostatic actuators with multiple degrees of freedom and multiple voltage sources. J Microelectromech Syst 15:131–140
Erts D, Olin H, Ryen L, Olsson E, Tholen A (2000) Maxwell and Sharvin conductance in gold point contacts investigated using TEM-STM. Phys Rev 61:12725–12727
Fomani AA, Mansour MM (2009) Miniature RF MEMS switch matrices. IMS 2009:1221–1224
Fortini A, Mendelev MI, Buldyrev S, Srolovitz D (2008) Asperity contacts at the nanoscale: comparison of Ru and Au. J Appl Phys 104:074320
George T (2002) MEMS/NEMS development for space applications at NASA/JPL. Proc SPIE 4755:556–567
Holm R (1967) Electric contacts: theory and applications, 4th edn. Springer, Berlin, New York
Homentcovschi D, Miles RN (2005) Viscous damping of perforated planar micromechanical structures. Sens Actuators A119:544–552
Iyer S, Zhou Y, Mukherjee T (1999) Analytical modeling of cross-axis coupling in micromechanical springs. In: Proceedings of 1999 Int Conference on Modeling and Simulation of Microsystems, pp 632–635
Janson SW, Helvajian H (1999) MEMS, microengineering and aerospace systems. AIAA 99:3802
Jensen BD, Chow LLW, Huang K, Saitou K, Volakis JL, Kurabayashi K (2005) Effect of nanoscale heating on electrical transport in RF MEMS switch contacts. J Microelectromech Syst 14:935–946
Jeong SJ, Lee DE, Wang W (2007) Mathematical analysis and test of an electrostatically actuated micro-power relay. Microsyst Technol 13:635–645
Kaajakari V (2009) Practical MEMS. Small Gear Pub, Las Vegas
Keimel C, Claydon G, Li B, Park JN, Valdes ME (2012) Microelectromechanical-systems-based switches for power applications. IEEE Trans Ind Appl 48:1163–1169
Kwon H, Jang SS, Park YH, Kim TS, Kim YD, Nam HJ, Joo YC (2008) Investigation of the electrical contact behaviors in Au-to-Au thin-film contacts for RF MEMS switches. J Micromech Microeng 18:105010
Leus V, Elata D (2004) Fringing effect in electrostatic actuators. Technical Report ETR-2004-2, Faculty of mechanical engineering, Technion-Israel Institute of Technology
Nishijima N, Hung JJ, Rebeiz GM (2004) Parallel-contact metal-contact RF-MEMS switches for high power applications. IEEE 2004:781–784
Ozkeskin FM, Choi S, Sarabandi K, Gianchandani YB (2012) An all-metal micro-relay with bulk foil Pt-Rh contacts for high-power RF applications. IEEE Trans Microw Theory Tech 60:1595–1604
Palmer HB (1937) The capacitance of a parallel-plate capacitor by the Sckwartz–Christoffel transformation. Trans AIEE 56:363–366
Patel CD, Rebeiz GM (2012) A high-reliability high-linearity high-power RF MEMS metal-contact switch for DC-40-GHz applications. IEEE Trans Microw Theory Tech 60:3096–3112
Shea HR (2006) Reliability of MEMS for space applications. Proc SPIE 6111:61110A
Sniegowski JJ, de Boer MP (2000) IC-compatible polysilicon surface micromachining. Annu Rev Mater Sci 200030:299–333
Song YH, Han CH, Kim MW, Lee JO, Yoon JB (2012) An electrostatically actuated stacked-electrode MEMS relay with a levering and torsional spring for power applications. J Microelectromech Syst 21:1209–1217
Souad O, Abdelmadjid B, Nabil B (2013) MEMS systems for industrial and space applications. In: Proceedings of the 5th International Conference on Electronics Engineering (ICEE 2013)
Tan SG, McErlean EP, Hong JS, Cui Z, Wang L, Greed RB, Voyce DC (2005) Electromechanical modelling of high power RF-MEMS switches with ohmic contact. In: Proceedings of the 13th GAAS Symposium-Paris, pp 505–508
Verger A, Pothier A, Guines C, Crunteanu A, Blondy P, Orlianges JC, Dhennin J, Broue A, Courtade F, Vendier O (2010) Sub-hundred nanosecond electrostatic actuated RF MEMS switched capacitors. J Micromech Microeng 20:064011
Wang L, Cui Z, Hong JS, McErlean EP, Greed RB, Voyce DC (2006) Fabrication of high power RF MEMS switches. Microelectron Eng 83:1418–1420
Weber AC, Lang JH, Slocum AH (2007) {111} Si etched planar electrical contacts for power MEMS-relays. In: Proceedings of 53rd IEEE Holm Conference on Electrical Contacts, pp 156–159
Acknowledgments
This work was supported by the State Key Laboratory of Precision Measurement Technology and Instruments. The authors would like to acknowledge the support of the Institute of Microelectronics at Peking University. They also thank G. Z. Yan very much for her helpful suggestions and discussions.
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Ma, B., You, Z., Ruan, Y. et al. Electrostatically actuated MEMS relay arrays for high-power applications. Microsyst Technol 22, 911–920 (2016). https://doi.org/10.1007/s00542-015-2660-y
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DOI: https://doi.org/10.1007/s00542-015-2660-y