The rheological properties of solder and solar pastes and the effect on stencil printing

Abstract

Solar and solder pastes are widely used in the electronics industry. Solder paste is the principal joining medium in the assembly of surface mount components, whilst solar paste is used in the manufacture of semiconductor solar cells in the photo-voltaic industry. The stencil printing of both solder and solar pastes is a very important and critical stage in the assembly process. With miniaturisation of components, this is likely to continue. The challenge in stencil printing at such dimensions is in achieving repeatable deposition of both solar and solder pastes from print to print. To meet this challenge requires an understanding of the flow behaviour of both solar and solder pastes.

The rheological properties of solar and solder pastes have been evaluated through three different types of experiments. Existing models were applied to compare their rheological behaviour under these schemes. One striking difference was that solar paste showed a higher viscosity than solder paste. Both solar and solder pastes were found to be non-Newtonian materials, showing a decrease in viscosity with increasing shear rates. In this paper we investigate the rheological properties of both solder and solar paste under steady shear and creep-recovery tests.