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A new computer-aided tolerance analysis and optimization framework for assembling processes using DP-SDT theory

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Abstract

Tolerance analysis is frequently used in predicting the product quality and balancing the design tolerances in mechanical assemblies. Generally, the tolerance analysis procedure is rather complex and cumbersome, and the existing computer-aided tolerance analysis methods are insufficient in dealing with some assembly information and user-defined quality requirements. This paper presents a new comprehensive tolerance analysis and optimization framework using deviation propagation and small displacement torsor (DP-SDT) theory. In this framework, four modules are designed to model the tolerances, analyze the assembly processes, predict the product quality, and optimize the tolerances respectively. Comparing with the existing methods, this framework can better support the complex assembly information like 3D dimensional tolerances, geometric dimensioning and tolerancing (GD&Ts), different tolerance zones, geometric information, assembly sequence, and various kinds of locating modes. And more practical quality requirements besides the distance precisions can be analyzed. The framework is a helpful supplement in tolerance analysis field. An application prototype using the framework has been developed for SolidWorks, and a tolerance optimization example of lathe saddle is provided to verify the performance of the framework.

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Authors and Affiliations

  1. Huazhong University of Science and Technology, Wuhan, China

    Hai Li, Haiping Zhu, Xuan Zhou & Peigen Li

  2. Chengdu Aircraft Industrial (Group) Co., Ltd, Wuhan, China

    Zhiqiang Yu

Authors
  1. Hai Li
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  2. Haiping Zhu
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  3. Xuan Zhou
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  4. Peigen Li
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  5. Zhiqiang Yu
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Correspondence to Haiping Zhu.

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Li, H., Zhu, H., Zhou, X. et al. A new computer-aided tolerance analysis and optimization framework for assembling processes using DP-SDT theory. Int J Adv Manuf Technol 86, 1299–1310 (2016). https://doi.org/10.1007/s00170-015-8266-9

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  • DOI: https://doi.org/10.1007/s00170-015-8266-9

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