Abstract
For over 20 years, wire sawing has been the primary method used for slicing ingots of silicon, sapphire, and silicon carbide into wafer substrates. Fixed diamond wire sawing has recently emerged as an alternative to slurry wire sawing as a means to shorten the time required for slicing and reduce the usage of slurry. The distribution of diamond grains on the wires strongly influences slicing performance in terms of material removal, surface topography, and subsurface damage. However, few studies have investigated this topic. This study established a model with which to simulate the distribution of diamond grains. Simulation results demonstrate that a higher density distribution reduces the rate of material removal because the loading is shared by the abrasives, thereby preventing the grains from penetrating deeply enough into the workpiece to facilitate the removal of material. Lower distribution density was shown to increase the loadings on the abrasives. These results demonstrate the importance of distribution density of diamond abrasives on the wire with regard to slicing performance.
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Abbreviations
- A hij :
-
Horizontal projected penetration area of the ith abrasive on the jth wire cross section
- A vij :
-
Vertical projected penetration area of the ith abrasive on the jth wire cross section
- AF ij :
-
The force applied on the ith abrasive on the jth wire cross section from wire tension
- c :
-
Length of lateral crack
- d :
-
Average wire cross-section interval
- E :
-
Yound’s modulus of material
- F j :
-
Tangential force applied to the jth wire cross section or jth abrasive in one-dimensional model
- H :
-
Hardness of material
- h :
-
Abrasive penetration depth
- h c :
-
Depth of the lateral crack
- h j :
-
Displacement of the jth wire cross section due to the normal loading N j
- K c :
-
Fracture toughness of material
- L :
-
Length of wire which is in contact with workpiece
- N j :
-
Normal loading applying to the jth wire cross section or jth abrasive in one-dimensional model
- n :
-
Number of wire cross sections
- P :
-
Pressure required to produce plastic deformation
- r ij :
-
Radius of the ith penetrated conical abrasive on the jth wire cross section
- T j :
-
Wire tension on the left hand side of the jth wire cross section or jth abrasive in one-dimensional model
- Q :
-
Material removal per sliding distance
- α ij :
-
Position angle of the ith diamond abrasive on the jth wire cross section
- β :
-
Bow angle of the wire
- β j :
-
Deviation angle of the jth wire segment with respect to the tangental direction of the jth wire cross section
- ϕ :
-
Half tip angle of diamond grain
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Chung, C., Tsay, G.D. & Tsai, MH. Distribution of diamond grains in fixed abrasive wire sawing process. Int J Adv Manuf Technol 73, 1485–1494 (2014). https://doi.org/10.1007/s00170-014-5782-y
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DOI: https://doi.org/10.1007/s00170-014-5782-y