Abstract
We explored the electrical properties of Au/Al2O3/p-Si diodes subjected to in situ atomic layer deposition (ALD) preceded by H2O pulsing, and derived capacitance–voltage (C–V) curves. Prepulsed samples exhibited lower frequency dispersion in the accumulation region, and negligible frequency dispersion in the inversion region, compared to control samples. The test samples also showed less marked flatband voltage shifts in terms of C–V hysteresis (about 60% reduction at 1 MHz). Analysis of frequency-dependent parallel conductance revealed that H2O prepulsing reduced the interface trap density. The exponential dependence of the time constant of applied voltage deviated from linearity for samples not subjected to H2O prepulsing, attributable to non-uniformity of the oxide charges. Border traps evident in the accumulation region at ~ 0.32 eV above the Si valence band with the time constant about 1 μs were passivated by H2O prepulsing. These results suggest that H2O prepulsing is a promising surface treatment for Si prior to ALD deposition.
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References
G. Wilk, R. Wallace, J. Anthony, J. Appl. Phys. 89, 5243 (2001)
G. Dingemans, W. Kessels, J. Vac. Sci. Technol., A 30, 040802 (2012)
B. Hoex, J. Schmidt, P. Pohl, M. van de Sanden, W. Kessels, J. Appl. Phys. 104, 044903 (2008)
G. Dingemans, N. Terlinden, M. Verheijen, M. van de Sanden, W. Kessels, J. Appl. Phys. 110, 093715 (2011)
F. Werner, B. Veith, D. Zielke, L. Kühnemund, C. Tegenkamp, M. Seibt, R. Brendel, J. Schmidt, J. Appl. Phys. 109, 113701 (2011)
L. Green, M. Ho, B. Busch, G. Wilk, T. Sorsch, T. Conard, B. Brijs, W. Vandervorst, P. Raisanen, D. Muller, M. Bude, J. Grazul, J. Appl. Phys. 92, 7168 (2002)
S. Kim, C. Hwang, J. Appl. Phys. 96, 2323 (2004)
S. Lee, J. Baik, K. An, Y. Suh, J. Oh, Y. Kim, J. Phys. Chem. B 108, 15128 (2004)
C. Lin, Y. Chen, C. Lee, H. Chang, W. Chang, C. Liu, ECS Trans. 33, 80 (2010)
S. Swaminathan, Y. Oshima, M. Kelly, P. McIntyre, Appl. Phys. Lett. 95, 032907 (2009)
L. Zhang, Y. Guo, V. Hassan, K. Tang, M. Foad, J. Woicik, P. Pianetta, J. Robertson, P. McIntyre, ACS Appl. Mater. Interfaces. 8, 19110 (2016)
Y. Xuan, H. Lin, P. Ye, G. Wilk, Appl. Phys. Lett. 88, 263518 (2006)
H. Harris, N. Biswas, H. Temkin, S. Gangopadhyay, M. Strathman, J. Appl. Phys. 90, 5825 (2001)
P. Bolshakov, P. Zhao, A. Azcatl, P. Hurley, R. Wallace, C. Young, Appl. Phys. Lett. 111, 032110 (2017)
Y. Xuan, H. Lin, P. Ye, I.E.E.E. Trans, Electron Dev. 54, 1811 (2007)
C. Yen, M. Lee, Jpn. J. Appl. Phys. 53, 121201 (2014)
H. Altuntas, C. Ozgit-Akgun, I. Donmez, N. Biyikli, J. Appl. Phys. 117, 155101 (2015)
D. Wei, T. Hossain, D. Briggs, J. Edgar, ECS J. Solid State Technol. 3, N127 (2014)
S. Gupta, E. Simoen, R. Loo, O. Madia, D. Lin, C. Merckling, Y. Shimura, T. Conard, J. Lauwaert, H. Vrielinck, M. Heyns, ACS Appl. Mater. Interfaces. 8, 13181 (2016)
N. Saks, M. Ancona, IEEE Electron Dev. Lett. 11, 339 (1990)
C. Hu, Modern Semiconductor Devices for Integrated Circuits (Pearson, New Jersey, 2009)
B. Ren, M. Sumiya, M. Liao, Y. Koide, X. Liu, Y. Shen, L. Sang, J. Alloys Compd. 767, 600 (2018)
P. Kordoš, R. Stoklas, D. Gregušová, J. Novák, Appl. Phys. Lett. 94, 223512 (2009)
P. Fiorenza, G. Greco, F. Iucolano, A. Patti, F. Roccaforte, Appl. Phys. Lett. 106, 142903 (2015)
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This study was supported by a Research Program of the Seoul National University of Science and Technology (Seoultech).
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Kim, H., Choi, B.J. Si Surface Passivation by Atomic Layer Deposited Al2O3 with In-Situ H2O Prepulse Treatment. Trans. Electr. Electron. Mater. 20, 359–363 (2019). https://doi.org/10.1007/s42341-019-00126-6
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DOI: https://doi.org/10.1007/s42341-019-00126-6