Skip to main content
SpringerLink
Log in

Dispersion strengthening for dimensional stability in low-melting-point solders

  • Research Summary
  • Dimensionally Stable Solders
  • Published:
JOM Aims and scope Submit manuscript

Abstract

An improved solder structure with an ultrafine grain size of ∼200–500 nm and significantly enhanced mechanical properties has been created by incorporating nanosized, nonreacting, noncoarsening oxide dispersoids into solder alloys. These solders display up to three orders of magnitude reduction in the steady-state creep rate, 4–5 times higher tensile strength at low strain rates, and improved ductility under highstrain-rate deformation. With a dispersion of TiO2 particles, the Pb-Sn eutectic solder with a low-melting point of 183°C can be made more creep resistant than the Au-20Sn eutectic solder with a much higher melting point of 278°C. This technique can be extended to other solder systems, such as the emerging lead-free solder alloys, and used to achieve enhanced dimensional stability.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. R.A. Boudreau, JOM, 46 (6) (1994), p. 41.

    Google Scholar 

  2. D.R. Frear, in Ref. 1, p. 40.

    Google Scholar 

  3. Y.C. Lee and N. Basavanhally, in Ref. 1, p. 46.

    CAS  Google Scholar 

  4. J. L. Marshall et al., IEEE Trans. Comp., Hybrids, Manuf. Technol., 14 (1991), p. 698.

    Article  CAS  Google Scholar 

  5. J.A. Wasynczuk and G.K. Lucey, Proc. NEPCON West (Des Plains, IL: Cahners Exhibition Group, 1992), pp. 1245–1255.

    Google Scholar 

  6. R.B. Clough et al., in Ref. 5, pp. 1256–1265.

    Google Scholar 

  7. H. S. Bertrabet and S. McGee, in Ref. 5, pp. 1276–1277.

    Google Scholar 

  8. M. McCormack, S. Jin, and G.W. Kammlott, IEEE Trans. Comp., Hybrids, Manuf. Technol., 17 (1994), p. 452.

    CAS  Google Scholar 

  9. S. Jin and M. McCormack, J. Electron. Mater., 23 (1994), p. 735.

    CAS  Google Scholar 

  10. D.R. Frear, D. Grivas, and J.W. Morris Jr., J. Electron. Mater., 17 (2) (1988), p. 171.

    CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Bell Laboratories, Lucent Technologies, USA

    H. Mavoori & S. Jin

Authors
  1. H. Mavoori
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S. Jin
    View author publications

    You can also search for this author in PubMed Google Scholar

Additional information

For more information, contact H. Mavoori, Bell Laboratories, Lucent Technologies, 1A-102 Bell Labs, 600 Mountain Avenue, Murray Hill, New Jersey 07974; e-mail hareesh@lucent.com.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Mavoori, H., Jin, S. Dispersion strengthening for dimensional stability in low-melting-point solders. JOM 52, 30–32 (2000). https://doi.org/10.1007/s11837-000-0145-6

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11837-000-0145-6

Keywords

Search

Navigation