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Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films

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Abstract

Thermocompression bonding of through-layer copper interconnects is of great interest for fabrication of three-dimensional (3D) integrated circuits. We have investigated interactions of Cu films with noneutectic Sn-In at length scales of 1 μm to 5 μm. The effects of bonding time, bonding temperature, and post- bonding annealing temperature on intermetallic compound (IMC) formation, joint microstructure, and shear strength were investigated using scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS), x-ray diffractometry (XRD), and shear testing. It is shown that bonding temperature plays an important role in increasing the true contact area, while the postbonding annealing temperature affects the formation of a single IMC, the η-phase [Cu6(Sn,In)5]. Both of these phenomena were found to contribute to the shear strength of the joints. It is shown that two-step bonding processes, involving short bonding times and longer postbonding annealing, can be used to optimize the bond formation for increased throughput.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore

    Wardhana A. Sasangka & Chee Lip Gan

  2. Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore, 117576, Singapore

    Wardhana A. Sasangka, Chee Lip Gan & Carl V. Thompson

  3. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA

    Carl V. Thompson

  4. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore, 117685, Singapore

    Won Kyoung Choi

  5. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore

    Jun Wei

Authors
  1. Wardhana A. Sasangka
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  2. Chee Lip Gan
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  3. Carl V. Thompson
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  4. Won Kyoung Choi
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  5. Jun Wei
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Correspondence to Chee Lip Gan.

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Sasangka, W.A., Gan, C.L., Thompson, C.V. et al. Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films. J. Electron. Mater. 40, 2329–2336 (2011). https://doi.org/10.1007/s11664-011-1747-1

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  • DOI: https://doi.org/10.1007/s11664-011-1747-1

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