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Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN x Layers

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Abstract

A comparative study of AlGaN/GaN high-electron-mobility transistor (HEMT) surface passivation using ex situ and in situ deposited SiN x is presented. Performing ex situ SiN x passivation increased the reverse gate leakage and off-state channel leakage by about three orders of magnitude. The in situ SiN x layer was characterized using transmission electron microscopy (TEM) and capacitance–voltage (CV) measurements. Photoluminescence (PL) spectra indicated a reduction of nonradiative recombination centers in in situ SiN x -passivated samples, indicating improved crystal quality. CV measurements indicated a reduction of surface state density as well, and thus better overall passivation using in situ SiN x . Electroluminescence (EL) images of the channel regions in AlGaN/GaN HEMT devices operating in forward blocking mode with up to 400 V drain bias demonstrated reduced channel emission profiles of in situ-passivated devices. Compared with a nonpassivated reference sample, the reduced EL emission profiles correlated with a reduced channel temperature on ex situ SiN x -passivated devices.

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Correspondence to Marko J. Tadjer.

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Tadjer, M.J., Anderson, T.J., Hobart, K.D. et al. Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiN x Layers. J. Electron. Mater. 39, 2452–2458 (2010). https://doi.org/10.1007/s11664-010-1343-9

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  • DOI: https://doi.org/10.1007/s11664-010-1343-9

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