Skip to main content
SpringerLink
Log in

Effect of Oxidation on Indium Solderability

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The fluxless solderability of pure indium on gold-coated surfaces is investigated in this study using measurements of wetting angle and joint strength. This study focuses on the effects of indium’s native oxides and those which form during heat treatment. The initial oxide thicknesses are obtained by heating indium samples at various temperatures, and then, during the reflow above the melting temperature, oxidation at the interface is either allowed in open air or prevented by reflowing in an inert environment. The testing results presented include characterization of indium oxide (In2O3), the effects of indium oxide on joint strength, and the effect of hot pressing during reflow process.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. M. Abtew, G. Selvaduray, Mat. Sci. Eng. 27, 95 (2000)

    Article  Google Scholar 

  2. Y.-C. Chen, C.C. Lee, Thin Solid Films 283, 243 (1996)

    Article  CAS  Google Scholar 

  3. C.C Lee, S. Choe, Mat. Sci. Eng. A 333, 45 (2002)

    Article  Google Scholar 

  4. J. F. Kuhmann, A. Preuss, B. Adolphi, K. Maly, T. Wirth, W. Oesterle, W. Pittroff, G. Weyer, M. Fanciulli, IEEE Trans. Compon. Pack. Manuf. Tech. 21, 134 (1998)

    Article  Google Scholar 

  5. F.S. Shieu, C.F. Chen, J.G. Sheen, Z.C. Chang, Thin Solid Films 346, 125 (1999)

    Article  CAS  Google Scholar 

  6. Kim J., Schoeller H., Cho, J., Park SB, Electr. Mater. Lett. 2, 167 (2006)

    CAS  Google Scholar 

Download references

Acknowledgements

The authors wish to acknowledge financial support from the Office of Naval Research. Helpful discussions with Dr. H.C. at SUNY Binghamton, and Drs. D. Jean and M. Deeds at the Naval Surface Welfare Center are greatly appreciated.

Author information

Authors and Affiliations

  1. PKG Technology Team, Samsung Electro-Mechanics Co., 314 Maetan3-Dong, Yeongtong-Gu, Suwon, Gyunggi-Do, 443-743, Korea

    Jongman Kim

  2. Department of Mechanical Engineering, State University of New York at Binghamton, PO Box 6000, Binghamton, NY, 13902, USA

    Harry Schoeller, Junghyun Cho & Seungbae Park

Authors
  1. Jongman Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Harry Schoeller
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Junghyun Cho
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Seungbae Park
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jongman Kim.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Kim, J., Schoeller, H., Cho, J. et al. Effect of Oxidation on Indium Solderability. J. Electron. Mater. 37, 483–489 (2008). https://doi.org/10.1007/s11664-007-0346-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-007-0346-7

Keywords

Search

Navigation