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Creep deformation behavior of Sn–Zn solder alloys

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Abstract

Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50–75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.

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References

  1. The European Parliament and the Council of the European Union (2003) Directive 2002/95/EC on the restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment. J Eur Union 46(L 37):24–38

    Google Scholar 

  2. Plumbridge WJ, Gagg CR, Peters S (2001) The creep of lead-free solders at elevated temperatures. J Electron Mater 30:1178–1183

    Article  Google Scholar 

  3. Sidhu RS, Deng X, Chawla N (2008) Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: part II. Creep behavior of bulk solder and solder/copper joints. Metall Mater Trans 39A:349–362

    Article  Google Scholar 

  4. Guo F, Choi S, Subramanian KN, Bieler TR, Lucas JP, Achari A, Paruchuri M (2003) Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions. Mater Sci Eng A351:190–199

    Article  Google Scholar 

  5. Dutta I (2013) A constitutive model for creep of lead free solders undergoing strain-enhanced microstructural coarsening: a first report. J Electron Mater 32:201–207

    Article  Google Scholar 

  6. Mavoori H, Chin T, Vaynman S, Moran B, Keer L, Fine M (1997) Creep, stress relaxation, and plastic deformation in Sn–Ag and Sn–Zn eutectic solders. J Electron Mater 26:783–790

    Article  Google Scholar 

  7. Rani SD, Murthy GS (2004) Impression creep behavior of tin based lead free solders. Mater Sci Technol 20:403–408

    Article  Google Scholar 

  8. Kitajima M, Shono T (2005) Development of Sn–Zn–Al lead-free solder alloys. Fujitsu Sci Tech J 41:225–235

    Google Scholar 

  9. Kim YS, Kim KS, Hwang CW, Suganuma K (2003) Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys. J Alloys Compd 352:237–242

    Article  Google Scholar 

  10. Mahmudi R, Geranmayeh AR, Noori H, Shahabi M (2008) Impression creep of hypoeutectic Sn–Zn lead-free solder alloys. Mater Sci Eng A491:110–116

    Article  Google Scholar 

  11. Sakr MS, Mohamed AZ, El-Daly AA, Abdel-Daiem AM, Bassyouni AH (1990) Microstructure dependence of steady state creep in Sn–Zn alloys. Egypt J Solids 13:34–41

    Google Scholar 

  12. Suganuma K, Kim SJ, Kim KS (2009) High temperature lead-free solders: properties and possibilities. JOM 61:64–71

    Article  Google Scholar 

  13. Sastry DH, Murthy GS (1986) Impression creep behavior of metals at high temperatures. Trans Ind Inst Met 39:369–379

    Google Scholar 

  14. Baker H, Okamoto H (1992) ASM handbook: alloy phase diagrams, vol 3. ASM International, Materials Park

    Google Scholar 

  15. Vnuk F, Sahoo M, Baragar D, Smith RW (1980) Mechanical properties of Sn–Zn eutectic alloys. J Mater Sci 15:2573–2583. doi:10.1007/BF00550762

    Article  Google Scholar 

  16. Yu EC, Li JCM (1977) Impression creep of LiF single crystals. Philos Mag 36:811–825

    Article  Google Scholar 

  17. Hussien S, Jung YH, Murty KL (1985) An evaluation of mechanical anisotropy of Zircaloy using impression testing. Scripta Met 19:1045–1048

    Article  Google Scholar 

  18. Godavarti PS, Murty KL (1987) Creep anisotropy of zinc using impression tests. J Mater Sci Lett 6(1987):456–458

    Article  Google Scholar 

  19. Bird JE, Mukherjee AK, Dorn JE (1969) Correlations between high temperature creep behavior and structure. In: Brandon DG, Rosen A (eds) Quantitative relation between properties and microstructure. Israel University Press, Jerusalem, pp 255–342

    Google Scholar 

  20. Subrahmanyam B (1972) Elastic moduli of some eutectic alloys. Trans Jpn Inst Met 13:89–92

    Google Scholar 

  21. Mathew MD, Yang H, Movva S, Murty KL (2005) Creep deformation characteristics of tin and tin based electronic solder alloys. Metall Mater Trans A36:99–105

    Article  Google Scholar 

  22. Charit I, Murty KL (2008) Creep behavior of Nb-modified zirconium alloys. J Nucl Mater 374:354–363

    Article  Google Scholar 

  23. Boas W, Fensham PJ (1949) Rate of self-diffusion in tin crystals. Nature 164:1127–1128

    Article  Google Scholar 

  24. Sherby OD, Burke PM (1967) Mechanical behavior of crystalline solids at elevated temperature. Prog Mater Sci 1:325–390

    Google Scholar 

  25. Meakin JD, Klokholm E (1960) Self-diffusion in tin single crystals. Trans AIME 218:463–466

    Google Scholar 

  26. Devries KL, Baker GS, Gibbs P (1963) Effect of pressure on creep in tin. J Appl Phys 34:2258

    Article  Google Scholar 

  27. Wiseman CD, Sherby OD, Dorn JE (1957) Creep of single crystals and polycrystals of aluminum, lead and tin. Trans AIME 9:57–59

    Google Scholar 

  28. Bonar LG, Craig GB (1958) Activation energy for creep in tin. Can J Phys 36:1445–1449

    Article  Google Scholar 

  29. Yang F, Li JCM (2007) Deformation behavior of tin and some tin alloys. J Mater Sci Mater Electron 18:191–210

    Article  Google Scholar 

  30. Shrestha T, Basirat M, Charit I, Potirniche G, Rink K, Sahaym U (2012) Creep deformation mechanisms in modified 9Cr–1Mo steel. J Nucl Mater 423:110–119

    Article  Google Scholar 

  31. Huang FH, Huntington HB (1974) Diffusion in Sb124, Cd109, Sn113 and Zn65. Phys Rev B 9:1479–1488

    Article  Google Scholar 

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Author notes

  1. Srikant Gollapudi

    Present address: Saint-Gobain India, Chennai, India

  2. Triratna Shrestha

    Present address: Integrated Global Services, Midlothian, VA, USA

Authors and Affiliations

  1. University of Idaho, Moscow, ID, 83844-3024, USA

    Triratna Shrestha & Indrajit Charit

  2. North Carolina State University, Raleigh, NC, 27695-7909, USA

    Srikant Gollapudi & K. Linga Murty

Authors
  1. Triratna Shrestha
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  2. Srikant Gollapudi
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  3. Indrajit Charit
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  4. K. Linga Murty
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Correspondence to Indrajit Charit.

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Shrestha, T., Gollapudi, S., Charit, I. et al. Creep deformation behavior of Sn–Zn solder alloys. J Mater Sci 49, 2127–2135 (2014). https://doi.org/10.1007/s10853-013-7905-5

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  • DOI: https://doi.org/10.1007/s10853-013-7905-5

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