Abstract
Several existing methodologies have leveraged the correlation between the non-RF and the RF performances of a circuit in order to predict the latter from the former and, thus, reduce test cost. While this form of specification test compaction eliminates the need for expensive RF measurements, it also comes at the cost of reduced test accuracy, since the retained non-RF measurements and pertinent correlation models do not always suffice for adequately predicting the omitted RF measurements. To alleviate this problem, we explore several methodologies that estimate the confidence in the obtained test outcome. Subsequently, devices for which this confidence is insufficient are retested through the complete specification test suite. As we demonstrate on production test data from a zero-IF down-converter fabricated at IBM, the proposed methodologies overcome the inability of standard specification test compaction methods to reach industrially acceptable test quality levels, and enable efficient exploration of the tradeoff between test accuracy and test cost.
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Acknowledgments
We would like to thank IBM for providing the production test data employed in this study, as well as Dr. Haralampos Stratigopoulos from TIMA Laboratory in Grenoble, France, for the useful discussions on the methodologies described herein and developing the cost metric described in Section 3.4.
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Kupp, N., Drineas, P., Slamani, M. et al. On Boosting the Accuracy of Non-RF to RF Correlation-Based Specification Test Compaction. J Electron Test 25, 309–321 (2009). https://doi.org/10.1007/s10836-009-5113-7
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DOI: https://doi.org/10.1007/s10836-009-5113-7