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Thermophysical Properties of Electrically Conductive SiC–(Nb,Ti–C)ss-Based Cermets

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Abstract

Multifunctional cermets are being developed for a range of novel applications. The present paper deals with thermophysical properties of electrically conductive SiC-based cermets. The cermets were prepared by in situ reaction using a two-step sintering process. The thermophysical properties, namely, thermal conductivity, thermal diffusivity, and heat capacity, were measured using the pulse transient technique. The microstructure and chemical composition of the samples were characterized by SEM (scanning electron microscopy), TEM (transmission electron microscopy), STEM (scanning transmission electron microscopy), and EDX (energy dispersive X-ray analysis) techniques. The observed thermophysical data were correlated with the observed microstructures and chemical nature of the SiC-based cermets.

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Authors and Affiliations

  1. Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Račianska 75, 831 02, Bratislava, Slovakia

    Miroslav Balog

  2. Institute of Physics, Slovak Academy of Sciences, Dúbravská 9, 845 11, Bratislava, Slovakia

    Viliam Vretenár & L’udovít Kubičár

  3. Institute of Electrical Engineering, Slovak Academy of Sciences, Dúbravská 9, 841 04, Bratislava, Slovakia

    Ivo Vávra

  4. Department of Chemical Engineering and Materials Science, Michigan State University, 2527 Engineering Building, East Lansing, MI, 48824-1226, USA

    Jiaming Zhang & Martin A. Crimp

  5. Institute of Inorganic Chemistry, Slovak Academy of Sciences, Dúbravská 9, 841 04, Bratislava, Slovakia

    Zoltán Lenčéš

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  1. Miroslav Balog
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  2. Viliam Vretenár
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  3. Ivo Vávra
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  4. Jiaming Zhang
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  5. Martin A. Crimp
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  6. L’udovít Kubičár
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  7. Zoltán Lenčéš
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Correspondence to Viliam Vretenár.

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Balog, M., Vretenár, V., Vávra, I. et al. Thermophysical Properties of Electrically Conductive SiC–(Nb,Ti–C)ss-Based Cermets. Int J Thermophys 30, 1918–1930 (2009). https://doi.org/10.1007/s10765-009-0688-x

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  • DOI: https://doi.org/10.1007/s10765-009-0688-x

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