Abstract
This paper reports the results of a study on the effect of the cooling rate during solidification on the shear creep and low cycle shear fatigue behavior of 60 Sn/40 Pb solder joints, and on bulk solder tensile properties. Solder joints were made with three different initial microstructures by quenching, air-cooling and furnace-cooling. They have similar steady-state strain rates under creep at relatively high shear stresses (i.e. in the matrix creep region) but creep at quite different strain rates at lower shear stresses (i.e. in the grain boundary creep region). These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate. Tensile tests on bulk solders that were cold-worked, quenched and furnace-cooled show that a faster cooling rate decreases the ultimate strength and increases the ductility at low strain rates. The fatigue life of quenched solder joints is shown to be longer than that of the furnace-cooled joints.
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Mei, Z., Morris, J.W., Shine, M.C. et al. Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints. J. Electron. Mater. 20, 599–608 (1991). https://doi.org/10.1007/BF02669524
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DOI: https://doi.org/10.1007/BF02669524