Abstract
The stress relaxation behaviour of 60Sn-40Pb solder in a joint configuration was investigated over a range of temperatures and two starting stresses. Unlike the bulk 60Sn-40Pb alloy, the deformation behaviour of the joint could not be described by a power law dependence between strain rate and stress. As expected, the amount of joint relaxation varied with the starting stress level. However, a dependence of the residual stress on the initial stress was also revealed: the more highly stressed specimens relaxed to a much lower final stress than did initially lower stressed specimens. Microstructural analysis of the deformed joint revealed extensive grain boundary sliding and inter Sn-Sn grain cracking.
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Tribula, D., Grivas, D. & Morris, J.W. Stress relaxation in 60Sn-40Pb solder joints. J. Electron. Mater. 17, 387–390 (1988). https://doi.org/10.1007/BF02652123
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DOI: https://doi.org/10.1007/BF02652123