Abstract
The residual stresses in a model of a plastically encapsulated microelectronic device are determined photoelastically using birefringent transfer-molding compounds. The measured stresses are compared with a laminated-platetheory analysis and then used to guide a two-dimensional finite-element analysis of the device. Photoelasticity was also used to determine the effects of postcure on the residualstress distribution.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Dale, J.R. andOldfield, R.C., “Mechanical Stresses Likely to be Encountered in the Manufacture and Use of Plastically Encapsulated Devices,”Microelectronics and Reliability,16,255–261 (1977).
Usell, R.J., Jr. and Smiley, S.A., “Experimental and Mathematical Determination of Mechanical Strains Within Plastic I.C. Packages and Their Effect During Environmental Tests,” 1981 IEEE/Proc. IRPS, 65–73 (1981).
Daniel, I.M. andDurelli, A.J., “Shrinkage Stresses Around Rigid Inclusions,”Experimental Mechanics,2 (8),240–244 (Aug.1962).
Sampson, R.C., “A Three-dimensional Photoelastic Method for Analysis of Differential-contraction Stresses,”Experimental Mechanics,3 (10),225–235 (Oct.1963).
Durelli, A.J. andParks, V.J., “New Method to Determine Restrained-shrinkage Stresses in Propellant-grain Models,”Experimental Mechanics,3 (11),263–268 (Oct.1963).
Durelli, A.J. andParks, V.J., “Photoelasticity Methods to Determine Stresses in Propellant-grain Models,”Experimental Mechanics,5 (2),33–46 (Feb.1965).
Parks, V.J. andDurelli, A.J., “Photoelastic Analysis of Plates Subjected to Restrained Shrinkage,”Experimental Mechanics,5,504–510 (1965).
Durelli, A.J. andParks, V.J., “Photoelastic Stress Analysis on the Bonded Interface of a Strip with Different End Conditions,”Amer. Ceramic Soc. Bul.,46,582–586 (1967).
Durelli, A.J., Parks, V.J. anddel Rio, C.J., “Stresses in a Square Slab Bonded on One Face to a Rigid Plate and Shrunk,”Acta Mech.,3 (4),352–359 (1967).
Durelli, A.J., Parks, V.J. anddel Rio, C.J., “Stresses in Square Slabs, with Different Edge Geometries, when Bonded on One Face to a Rigid Plate and Shrunk,”Experimental Mechanics,7 (11),481–484 (Nov.1967).
Parks, V.J., Chiang, Fu-pen andDurelli, A.J., “Maximum Stress at the Angular Corners of Long Strips Bonded on One Side and Shrunk,”Experimental Mechanics,8 (6),278–281 (June1968).
Asamoah, N.K. andWood, W.G., “Thermal Self-Straining of Fibre-Reinforced Materials,”J. Strain Anal.,5,88–97 (1970).
Riney, T.D., “Residual Thermoelastic Stresses in Bonded Silicon Wafers,”J. Appl. Phys.,32,454–460 (1961).
Kotake, H. andTakasu, S., “Quantitative Measurement of Stress in Silicon by Photoelasticity and its Application,”J. Electrochemical Soc.: Solid State Science and Technology,127,179–184 (1980).
Timoshenko, S.P., “Analysis of Bimetal Thermostats,”J. Opt. Soc. Amer.,11,233–236 (1953).
Jones, R.M., Mechanics of Composite Materials, McGraw Hill, New York (1975).
Becker, E.B. Chambers, R.S., Collins, L.R., Knauss, W.G., Liechti, K.M. and Romanko, J., “Viscoelastic Stress Analysis Including Moisture Diffusion for Adhesively Bonded Joints,” Final Rep. Contract #F33615-80-C-5167.
Kobayashi, A.S., “Hybrid Experimental-Numerical Stress Analysis,”Experimental Mechanics,23 (3),338–347 (Sept.1983).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Liechti, K.M. Residual stresses in plastically encapsulated microelectronic devices. Experimental Mechanics 25, 226–231 (1985). https://doi.org/10.1007/BF02325091
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02325091