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Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding

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Abstract

Cu-Cu2O eutectic bonding of copper to alumina has been studied at 1075°C in nitrogen gas. In order to elucidate the reaction at the Cu/Al2O3 interface, the bonding time was prolonged up to 24 h at 1075°C in nitrogen gas. CuAlO2 was found at the Cu/Al2O3 interface, and it seems that CuAlO2 was formed even with a short bonding time. CuAlO2 enhanced the bonding strength. There seem to be two kinds of bonding mechanism working at the Cu/Al2O3 interface.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Cheongryang, Seoul, Korea

    Sung Tae Kim & Chong Hee Kim

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  1. Sung Tae Kim
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  2. Chong Hee Kim
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Kim, S.T., Kim, C.H. Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding. J Mater Sci 27, 2061–2066 (1992). https://doi.org/10.1007/BF01117918

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  • DOI: https://doi.org/10.1007/BF01117918

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