Abstract
Nowadays, users need portable gadgets like laptops and cellular phones with small in size which occupies less area, consumes low power and having low cost. Justifying Moore’s law by designing the smaller size transistors on the silicon wafer, more numbers of transistors available on a single wafer help to design complicated circuits with very low cost. Scaling plays vital role to decide the size of transistor with high performance. Most attracted multi-gate technology for researchers as well for industry is Fin-FET for nano-scale design. The nano-scale Fin-FET technology provides best solution for Moore’s law. This paper focuses on how Fin-FET helps to reduce short channel effect and also presents design of 30 nm and 10 nm single Fin-FET with Triple Gate. Leakage current, threshold voltage and drain drive current evaluated from device design by using high K of dielectric material. Simulation carried out using COMSOL MULTIPHYSICS Version 5.3
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References
Narendar, Mishra, R.: Threshold voltage control schemes in FIN-FETS. Int. J. VLSI Des. Commun. Syst. (VLSICS) 3(2):175–191 (2012). https://doi.org/10.5121/vlsic.2012.3215
Anju, C.: Performance analysis of wavy Fin-FET and optimization for leakage reduction. In: 2016 IEEE International Symposium on Nano electronic and Information Systems, pp 83–85. https://doi.org/10.1109/iNIS.2016.43
Shukla, S., Gill S.S.: Comparative simulation analysis of process parameter variations in 20 nm triangular Fin-FET. Act Passive Electron Compon 2017, 8 pp. Article ID 5947819. https://doi.org/10.1155/2017/5947819.
Mishra, P., Anish, M., Jha, N.K.: Fin-FET circuit design. Nanoelectronic Circuit Design. Springer Science New York, pp 23–54 (2011)
Ranka, D., Rana, A.K.: Performance evaluation of FD-SOI MOSFETS for different metal gate work function. Int. J. VLSI Des. Commun. Syst. (VLSICS) 2(1), 11–24 (2011)
Chopade, S.S., Padole, D.V.: Dual material pile gate approach for low leakage FIN-FET. Int. J. Technol. (2017). https://doi.org/10.14716/ijtech.v8i1.3699
Fan, J.-C., Lee, S.-F.: Effect of oxide layer in metal-oxide-semiconductor systems. In: MATEC Web of Conferences SMAE 2016, 5 pp. https://doi.org/10.1051/06103 (2016). [matecconf/2016MATEC Web of Conferences 6SMAE 2016706103]
Keerti Kumar, K., Anil, P., Bheema, R.N.: Parametric variation with doping concentration in a Fin-FET using 3D TCAD. Int. J. Comput. Appl. 3, 21–23. [International Conference on Microelectronics, Circuits and Systems (MICRO-2014)] 0975 – 8887
Mohd Radzi, N., Sanudin, R.: Effect of oxide thickness variation in sub-micron NMOS transistor. Int. Res. Innov. Summit (IRIS2017) 10. IOP Publishing. https://doi.org/10.1088/1757-899X/226/1/012145
Somra, N., Sawhney, R.S.: 32 nm Gate Length Fin-FET: impact of doping. Research Gate (2015). Int. J. Comput. Appl. 122(6), 11–14 (2015). 0975 – 8887
Hasan, M., Hassan, E.: Study of scaling effects of a double gate silicon MOSFET. In: 10th International Conference on Electrical and Computer Engineering, 20–22 Dec 2018, pp. 169–172
Chaudhry, A.: Fundamentals of nano-scaled field effect transistors. Nanoscale Effects: Gate Oxide Leakage Currents. Springer Science New York (2013)
George James, T. Joseph, S.: The influence of metal gate work function on short channel effects in atomic-layer doped DG MOSFET. J. Electron Devices 8, 310–319 (2010)
Walke, A.M.: Design strategies for ultralow power 10 nm Fin-FETs. In: 2017 Rochester Institute of Technology RIT Scholar Works
Cerdeira, A., Estrada, M., Alvarado, J.: Review on double-gate Mosfets and Fin-Fets modeling. Facta Univ. Ser. Electron. Energetics 26(3), 197–213 (2013). https://doi.org/10.2298/FUEE1303197C
Farkhani, H., Peiravi, A., Kargaard, J.M., Moradi, F.: Comparative study of Fin-FETs versus 22 nm bulk CMOS technologies: SRAM design perspective. In: 2014 27th IEEE International System-on-Chip Conference (SOCC) 2–5 Sept 2014, pp. 449–454
Mushahhid Majeed, M.A., Rao, S.: Influence of thickness of oxide and dielectric constant on short channel metrics in Fin-FETs. J. Adv. Res. Dyn. Control Syst. 9(4), 57–64 (2017)
Nirmal, D., Thomas, D.M.: Impact of channel engineering on Fin-Fets using high-K dielectrics. Int. J. Micro Nano Electron. Cir. Syst. 3(1), 6 (2011)
Yin, H., Yao, J.: Advanced transistor process technology from 22- to 14-nm node (2018)
Sivasankaran, K., Mallick, P.S.: Impact of device geometry and doping concentration variation on electrical characteristics of 22 nm Fin-FET. In: 2013 (ICECCN 2013), pp. 528–531
Gupta, T.K.: Copper interconnect technology. Dielectric Materials. Springer Science (2009)
Shehata, N., Gaber, A.-R.: 3D multi-gate transistors: concept, operation, and fabrication. J. Electr. Eng. (2015)
Hossain, M.Z., Hossain, M.A.: Electrical characteristics of trigate Fin-FET. Glob. J. Researches Eng. Electr. Electron. Eng. (2011)
Carusone, T.C., Johns, D.A., Martin, K.W.: Analog Integrated Circuit Design, 2nd edn. John Wiley & Sons, Inc. (2012). ISBN 978-0-470-77010-8
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I thankfully acknowledge Ni2 Logic Design, Pune, for providing the licensed tool for implementation of Fin-FET fdesigns.
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Jagtap, S.M., Gond, V.J. (2021). “Device Design of 30 and 10 nm Triple Gate Single Finger Fin-FET for on Current (ION) and off Current (IOFF) Measurement”. In: Satapathy, S.C., Bhateja, V., Favorskaya, M.N., Adilakshmi, T. (eds) Smart Computing Techniques and Applications. Smart Innovation, Systems and Technologies, vol 224. Springer, Singapore. https://doi.org/10.1007/978-981-16-1502-3_80
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