Abstract
The single event effects (SEE) characteristic and hardening techniques of CMOS SRAM with sub-micron feature size are studied in the paper. After introducing the relationship SEE with the structure of memory cell, the rate of read-write, the feature sizes and the power supply, the SEE hardening techniques for the COMS SRAM are given from tow aspect: device-level hardening techniques and system-level hardening techniques. Finally, an error detection and correction (EDAC) design based on high reliability anti-fused FPGA is presented, this design has special real-time performance and high reliability, and has been adopted in a space-bone integrated processor platform, which works well in all kinds of environmental experiments.
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Xing-hua, H., Cong, Z., Yong-liang, Z., Huan-zhang, L. (2010). Studies on SEE Characteristic and Hardening Techniques of CMOS SRAM with Sub-micro Feature Sizes. In: Elleithy, K. (eds) Advanced Techniques in Computing Sciences and Software Engineering. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-3660-5_33
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DOI: https://doi.org/10.1007/978-90-481-3660-5_33
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