Abstract
Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.
Chapter PDF
Similar content being viewed by others
Keywords
References
Balmelli, L.: An Overview of the Systems Modeling Language for Products and Systems Development. J. Object Technology 6(6), 149–177 (2007)
Chandrakasan, A., Sheng, A., Brodersen, W.: Low-power CMOS digital design. IEEE J. Solid-State Circuits 27(4), 473–484 (1992)
Consumer Reports, Our test finds new iPad hits 116 degrees while running games (2012), http://news.consumerreports.org/electronics/2012/03/our-test-finds-new-ipad-hits-116-degrees-while-running-games.html (accessed February 17, 2014)
Qualcomm, Snapdragon S4 Thermal Comparison and Butter Benchmark (2012), http://www.qualcomm.com/media/videos/snapdragon-s4-thermal-comparison-and-butter-benchmark (accessed February 17, 2014)
Siemens, Role of PLM in the Software Lifecycle. White Paper (2012), http://m.plm.automation.siemens.com/en_us/Images/15825_tcm1224-75783.pdf (accessed February 17, 2014)
Kuusela, J.: How variation changes when an embedded product ceases to be embedded? In: WICSA/ECSA, Companion Volume, p. 147 (2012)
Google. In: Google Press Event, San Francisco (July 24, 2013)
Hatakeyama, T., Ishizuka, M., Nakagawa, S.: Estimation of maximum temperature in 3D-integrated package by thermal network method. In: Electronics Packaging Technology Conference (EPTC), p. 68 (2010)
Hao, S., Ding, L., Halfond, W.G.J., Govindan, R.: Estimating android applications’ CPU energy usage via bytecode profiling. In: Green and Sustainable Software (GREENS) (2012), doi:10.1109/GREENS.2012.6224263
Moritz, A., Henriques, F.: Studies of Thermal Injury: II. The Relative Importance of Time and Surface Temperature in the Causation of Cutaneous Burns. Am. J. Pathology 23, 695–720 (1947)
Muraoka, Y., Seki, K., Nishimura, H.: A system level thermal design approach of elec- tronics products to resolve conflicting user requirements. In: Asia-Pacific Council on Systems Engineering 2013 (ACPOSEC 2013), Yokohama (September 2013a)
Muraoka, Y., Seki, K., Nishimura, H.: A System-Level Thermal Design Specification Development of Electronic Products Considering Software Changes. In: International Conference on Engineering Design 2013 (ICED 2013), Seoul, (August 2013b)
Roy, S.: An Equation for Estimating the Maximum Allowable Surface Temperatures of Electronic Equipment. In: 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), p. 54 (2011)
Seki, K., Nishimura, H., Zhu, S., Balmelli, L.: A Parametric Design Framework to Sup- port Structural and Functional Modeling of Complex Consumer Electronics Products. In: International Conference on Engineering Design 2011(ICED 2011), p. 282 (2011a)
Seki, K., Nishimura, H.: A module-based thermal design approach for distributed product development. Research in Engineering Design 22(4), 279–295 (2011b)
Zhang, L., Tiwana, B., Qian, Z., et al.: Accurate online power estimation and automatic battery behavior based power model generation for smartphones. In: CODES/ISSS ’10 Proceedings of the eighth IEEE/ACM/IFIP International Conference on Hard- ware/Software Codesign and System Synthesis, p. 105 (2010), doi:10.1145/1878961.1878982
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2014 IFIP International Federation for Information Processing
About this paper
Cite this paper
Muraoka, Y., Seki, K., Nishimura, H. (2014). Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics. In: Fukuda, S., Bernard, A., Gurumoorthy, B., Bouras, A. (eds) Product Lifecycle Management for a Global Market. PLM 2014. IFIP Advances in Information and Communication Technology, vol 442. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-45937-9_24
Download citation
DOI: https://doi.org/10.1007/978-3-662-45937-9_24
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-45936-2
Online ISBN: 978-3-662-45937-9
eBook Packages: Computer ScienceComputer Science (R0)