Skip to main content

Low Complexity Encoder for Crosstalk Reduction in RLC Modeled Interconnects

  • Conference paper
  • 2328 Accesses

Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 7373))

Abstract

Most of the encoding methods proposed in recent years have dealt with only RC modeled VLSI interconnects. For deep sub-micron (DSM) technologies, the effect of on-chip inductance has increased due to increasing clock frequency, reducing signal rise times and increasing on-chip interconnect length. This issue is a concern for signal integrity and overall chip performance. Therefore, this research work introduces an efficient bus encoder using Bus Inverting (BI) method. This method considerably reduces crosstalk, delay and power dissipation in RLC modeled circuits. The proposed encoder dissipates lower power which makes it suitable for current high-speed low power VLSI interconnects. It has been observed that on an average, the proposed encoder reduces power dissipation and propagation delay by 67.86% and 46.78%, respectively.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Elgamel, M.A., Bayoumi, M.A.: Interconnect noise analysis and optimization in deep submicron technology. IEEE Circuits Syst. Mag. 3(4), 6–17 (2003)

    Article  Google Scholar 

  2. He, L., Lepak, K.M.: Simultaneous Shield Insertion and Net ordering for Capacitive and Inductive Coupling Minimization. In: Int. Symp. Physical Design, pp. 55–60 (2000)

    Google Scholar 

  3. Shang-Wie, T., Yao-Wen, C., Jing-Yang, J.: RLC Coupling-Aware Simulation and On-Chip Bus Encoding for Delay Reduction. IEEE Transaction on Computer-Aided Design of Integrated Circuits and Systems 25(10) (2006)

    Google Scholar 

  4. Peng Fan, C., Hao Fang, C.: Efficient RC low-power bus encoding methods for crosstalk reduction. Integration, the VLSI Journal 44(1), 75–86 (2011)

    Article  Google Scholar 

  5. Stan, M.R., Burleson, W.P.: Bus-Invert Coding for Low-Power I/O. IEEE Trans. VLSI Syst. 3, 49–58 (2005)

    Article  Google Scholar 

  6. Nagendra babu, G., Agarwal, D., Kaushik, B.K., Manhas, S.K.: Power and Crosstalk Reduction using Bus Encoding Technique for RLC Modeled VLSI Interconnect. In: 2nd International Workshop on VLSI, pp. 424–434 (2011)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2012 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Nagendra Babu, G., Kaushik, B.K., Bulusu, A., Majumder, M.K. (2012). Low Complexity Encoder for Crosstalk Reduction in RLC Modeled Interconnects. In: Rahaman, H., Chattopadhyay, S., Chattopadhyay, S. (eds) Progress in VLSI Design and Test. Lecture Notes in Computer Science, vol 7373. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-31494-0_5

Download citation

  • DOI: https://doi.org/10.1007/978-3-642-31494-0_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-31493-3

  • Online ISBN: 978-3-642-31494-0

  • eBook Packages: Computer ScienceComputer Science (R0)

Publish with us

Policies and ethics