Abstract
This work concerns the thermal analysis of solid state devices, namely the solution of the heat transfer problem as part of the coupled electrical-thermal analysis of an IC. We investigate some typical numerical problems which can be found during evaluating of the time dependent solution of the heat diffusion equation for a 3D finite domain with an uniform heat source. Considering a surface heat source, the solutions obtained by means of the Large Time Greens Function and Small Time Greens Function are studied. A simple method to improve the computational efficiency is proposed. A comparison of different approaches is given as well.
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© 2004 Springer-Verlag Berlin Heidelberg
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Lisik, Z., Wozny, J., Langer, M., Rinaldi, N. (2004). Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling – A Numerical Aspect. In: Bubak, M., van Albada, G.D., Sloot, P.M.A., Dongarra, J. (eds) Computational Science - ICCS 2004. ICCS 2004. Lecture Notes in Computer Science, vol 3039. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-25944-2_132
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DOI: https://doi.org/10.1007/978-3-540-25944-2_132
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-22129-6
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