Skip to main content

Towards Integrating Imaging Techniques to Assess Manufacturing Features and In-Service Damage in Composite Components

  • Conference paper
  • First Online:
Book cover Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7

Abstract

Initial work on combining Thermoelastic Stress Analysis (TSA) and Digital Image Correlation (DIC) is presented with the purpose of exploring their used in assessing defects in composite materials. TSA is usually performed using photon detector cameras that are expensive, a further objective of the paper is to investigate the capabilities of low-cost bolometer IR cameras for TSA. A carbon fibre reinforced polymer (CFRP) sample with artificial ‘waviness’ was created, so that a crack was developed inside the material. Both TSA and lock-in DIC methods detected the damage inside the CFRP specimen. Using the bolometer for TSA has highlighted the need for longer data capture times and the deleterious effects of other features associated with image capture that are inherent in the bolometer system.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Rajic, N., Street, N.: A performance comparison between cooled and uncooled infrared detectors for thermoelastic stress analysis. Quant. Infrared Thermography J. 11(2), 207–221 (2014)

    Article  Google Scholar 

  2. Gade, R., Moeslund, T.B.: Thermal cameras and applications: a survey. Mach. Vis. Appl. 25, 245–262 (2014)

    Article  Google Scholar 

  3. Fruehmann, R.K., et al.: The use of a lock-in amplifier to apply digital image correlation to cyclically loaded components. Opt. Lasers Eng. 68, 149–159 (2015)

    Article  Google Scholar 

  4. Chen, D., et al.: Crack growth analysis in welded and non-welded T-joints based on lock-in digital image correlation and thermoelastic stress analysis. Int. J. Fatigue. 110, 172–185 (2018)

    Article  Google Scholar 

  5. Budzier, H., et al.: Fast microbolometer-based infrared camera system, presented at the 9th International Conference on Infrared Sensors & Systems, Nürnberg, Germany (2006)

    Google Scholar 

  6. Rajic, N., Rowlands, D.: Thermoelastic stress analysis with a compact low-cost microbolometer system. Quant. Infrared Thermography J. 10(2), 135–158 (2013)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to I. Jiménez-Fortunato .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2019 The Society for Experimental Mechanics, Inc.

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Jiménez-Fortunato, I., Bull, D.J., Dulieu-Barton, J.M., Thomsen, O.T. (2019). Towards Integrating Imaging Techniques to Assess Manufacturing Features and In-Service Damage in Composite Components. In: Baldi, A., Quinn, S., Balandraud, X., Dulieu-Barton, J., Bossuyt, S. (eds) Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-95074-7_18

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-95074-7_18

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-95073-0

  • Online ISBN: 978-3-319-95074-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics