Abstract
In this study, a multiscale approach was proposed to study delamination in a bi-material structure, which bridge molecular dynamics method and finite element method using cohesive zone model. Cohesive zone model parameters were derived from an interfacial molecular dynamics model under mechanical loading and were assigned to the cohesive zone element representing the interfacial behavior. Based on the multi-scale model, the material behavior at nanoscale was passed onto the continuum model under tensile loading condition.
This paper is based upon “A multiscale approach for investigation of interfacial delamination in electronic packages” by Haibo Fan and Matthew M. F. Yuen which appeared in Proceedings of Eurosime © 2007 IEEE.
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This study was financially supported by the Grant Research Founding 621907.
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Fan, H., Yuen, M.M.F. (2012). Investigation of Interfacial Delamination in Electronic Packages. In: Iwamoto, N., Yuen, M., Fan, H. (eds) Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Springer, Boston, MA. https://doi.org/10.1007/978-1-4614-1728-6_11
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DOI: https://doi.org/10.1007/978-1-4614-1728-6_11
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