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Ultrasonic Characterization of Solid-Solid Bonds from Microstructural Changes

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Review of Progress in Quantitative Nondestructive Evaluation

Abstract

In recent years, new methods of bonding solids have been introduced. These methods (e.g., diffusion bonding and pressure welding) can produce very high quality bonds. In favorable cases the strength of the material in the bond is nearly indistinguishable from that of the host. Similarly, metallographic analysis may indicate almost no microstructural change between the host material and the material in the bonding region. Since these bonds can be of such high quality, they are being used for critical joins. Consequently, an urgent need has arisen for reliable nondestructive inspection methods. This paper is concerned with the use of ultrasound to determine bond quality [1–5].

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References

  1. B. H. Hosten, L. A. Ahlberg, B. R. Tittmann, and J. Spingarn, “Ultrasonic Characterization of Diffusion Bonds”, in Review of Progress in Quantitative NDE, D. O. Thompson and D. E. Chimenti, Eds., (Plenum Press, NY, 1987), 6B, 1701).

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  2. D. K. Rehbein, D. K. Hsu, R. B. Thompson and T. A. Jones, “ultrasonic NDE of Tubing Pinch Welds”, ibid, p. 1737.

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  3. G. H. Thomas, J. R. Spingarn and S. E. Benson, “Ultrasonic Evaluation and Imaging of Tube Closure Welds”,ibid, p. 1747.

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  4. D. D. Palmer, D. K. Rehbein, J. F. Smith, and O. Buck, “NDE Characterization of Metallic Interfaces”, ibid, p. 1755.

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  5. T. A. Gray, R. B. Thompson and F. J. Margetan, “Ultrasonic NDE of Integrally Bladed Rotors”, ibid, p. 1763.

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  6. E. P. Papadakis, “Ultrasonic attenuation caused by scattering in polycrystalline media”, in Physical Acoustics, ed. W. P. Mason (Academic Press, NY, 1968), Vol. IVB, p. 276.

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© 1988 Plenum Press, New York

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Rose, J.H. (1988). Ultrasonic Characterization of Solid-Solid Bonds from Microstructural Changes. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0979-6_51

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  • DOI: https://doi.org/10.1007/978-1-4613-0979-6_51

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4612-8275-4

  • Online ISBN: 978-1-4613-0979-6

  • eBook Packages: Springer Book Archive

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