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Ultrasonic Velocities of C/AL Composites Determined by Laser Ultrasonic Method

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Review of Progress in Quantitative Nondestructive Evaluation

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Abstract

Composite materials have received wide-spread attention because of their enhanced mechanical properties and suitablility for specific applications. The fiber or particulate reinforced aluminum matrix composites are rapidly developing and considered as the best packaging materials in future[1,2]. They have outstanding properties of low density, high ratios of strength and stiffness to density, as well as can be tailored specifically for electronic packing.

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Author information

Authors and Affiliations

  1. Lab of Modern Acoustics and Institute of Acoustics, Nanjing University, Nanjing, 210093, China

    X. R. Zhang, D. Fei, C. M. Gan & S. Y. Zhang

  2. Institute of Composite Material, Shanghai Jiaotong University, Shanhai, 200030, China

    X. B. Yu, G. D. Zhang & R. J. Wu

Authors
  1. X. R. Zhang
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  2. D. Fei
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  3. C. M. Gan
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  4. S. Y. Zhang
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  5. X. B. Yu
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  6. G. D. Zhang
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  7. R. J. Wu
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Editor information

Editors and Affiliations

  1. Center for NDE, Ames Laboratory (USDOE) and Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa, 50011, USA

    Donald O. Thompson (Director, Anston Marston Distinguished Professor) (Director, Anston Marston Distinguished Professor)

  2. Center for NDE and Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, Ames, Iowa, 50011, USA

    Dale E. Chimenti

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© 1996 Springer-Verlag Berlin Heidelberg

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Zhang, X.R. et al. (1996). Ultrasonic Velocities of C/AL Composites Determined by Laser Ultrasonic Method. In: Thompson, D.O., Chimenti, D.E. (eds) Review of Progress in Quantitative Nondestructive Evaluation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-0383-1_158

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  • DOI: https://doi.org/10.1007/978-1-4613-0383-1_158

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-8027-6

  • Online ISBN: 978-1-4613-0383-1

  • eBook Packages: Springer Book Archive

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