Abstract
A flip chip package started with a ceramic substrate at the beginning. A Low CTE chip (silicon: 3ppm/°C) and a relatively low CTE substrate (alumina: 8ppm/°C) with a ductile solder joint (high lead solder) provided a good reliable system for high density packaging. However, it has disadvantages such as high cost, low electrical property, largeness, and heaviness. In early 1990s, an organic substrate utilizing an epoxy base printed circuit board technology has emerged. An underfill resin fills a gap between a chip and substrate and resolves a stress issue by a large CTE mismatch of a chip and an organic substrate (17ppm/°C). In this system, the stress at a flip chip joint is dispersed in to the total package entity. This technology opened a door to low cost, high electrical property, small and light package, and has spread throughout semiconductor packages. In this chapter, a major focus is put on the organic substrate technology. The material, process, and reliability influences to a package are described in detail. Particularly, it is emphasized that the basics why the organic substrate is designed in such a way as we see today. Though there are many variations in the organic substrate technology, the basics are common and very important for a productive and reliable package, and the future progress of a flip chip package is strongly dependent on the progress of such basics.
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Tsukada, Y. (2013). Substrate Technology. In: Tong, HM., Lai, YS., Wong, C. (eds) Advanced Flip Chip Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5768-9_7
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DOI: https://doi.org/10.1007/978-1-4419-5768-9_7
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