Abstract
Transmission Line Modelling, TLM, is an established technique for simulating electromagnetic fields in a wide variety of application areas. As with any numerical algorithm, the complexity of the problem that can be practically dealt with is determined by the availability of computational resources.
Particularly demanding of resources are simulations that involve a diverse range of physical scales, all of which have a discernable impact on the results of the simulation and which therefore must be adequately modelled. One recurring illustration of this, typical of EMC predictions, is the inclusion of thin wires in simulations of large-scale objects and where a significant volume of empty space must be modelled.
Previously, a specific TLM node has been developed that allows a single thin wire to be analytically embedded within one of the TLM nodes; centrally in 3D and arbitrarily placed in 2D. In this work we extend this formulation to provide a 2D TLM node that can include an arbitrary number of arbitrarily placed thin wires within one cell and which are coupled by their near fields. This is of particular interest for simulating cabling looms as well as for consideration of certain classes of micro-structured materials.
This is a preview of subscription content, log in via an institution to check access.
Preview
Unable to display preview. Download preview PDF.
References
C. Christopoulos, The Transmission-Line Modeling Method: TLM, IEEE Press, New York, 1995.
P. Naylor, C. Christopoulos, and P. B. Johns, Coupling between electromagnetic field and wires using transmission-line modelling, in Proceedings of the Inst. Electrical Engineering, 134, 1987, pp. 679–686.
P. B. Johns and K. Akhtarzad, The use of time domain diakoptics in time discrete models of fields, Int. J. Numer. Methods Eng, 17, 1–14 (1981).
P. Naylor and C. Christopoulos, A new wire node for modelling thin wires in electromagnetic field problems solved by transmission line modelling, IEEE Trans, Microw. Theory Technol. 38, 328–330 (1990).
A. J. Wlodarczyk and D. P. Johns, New wire interface for graded 3-D TLM, Electron. Lett. 28, 728–729 (1992).
P. Sewell, Y. K. Choong, and C. Christopoulos, An accurate thin-wire model for 3D TLM simulations, IEEE Trans. Electromag. Compat., 45, 207–217 (2003).
Y. K. Choong, P. Sewell, and C. Christopoulos, Accurate modelling of an arbitrary placed thin wire in a coarse mesh, IEEE Proc.-Sci, Meas. Technol. 149, 250–253 (2002).
Y. K. Choong, P. Sewell, and C. Christopoulos, New thin wire formulation for time-domain differential-equation models, Int. J. Numer. Modelling, 15, 489–501 (2002).
Y. K. Choong, P. Sewell, and C. Christopoulos, Hybrid node for description of thin wires based on analytical field representation in EMC problems, in IEEE 2002 International Symposiumon Electromagnetic Compatibility, Minneapolis, Minnesota, USA, August 19–23, 2002.
I. S. Gradshteyn, I. M. Ryzhik, and Alan Jeffrey (eds.), Table of Integrals, Series, and Products, Academic Press, San Diego, CA, 1993, pp. 879.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Biwojno, K., Sewell, P., Liu, Y., Christopoulos, C. (2007). Embedding Multiple Wires Within a Single TLM Node. In: Sabath, F., Mokole, E.L., Schenk, U., Nitsch, D. (eds) Ultra-Wideband, Short-Pulse Electromagnetics 7. Springer, New York, NY. https://doi.org/10.1007/978-0-387-37731-5_9
Download citation
DOI: https://doi.org/10.1007/978-0-387-37731-5_9
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-37728-5
Online ISBN: 978-0-387-37731-5
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)