Abstract
The integration of real hardware components into simulation environments requires a suitable interface. There are a variety of simulators with unique specific vendor dependent interfaces, which are not compatible in general and some of them cannot support features that are required by modern design tools. To overcome the resulting insuficience, the Open Model Interface (OMI) was de.ned. This paper shows that the OMI, developed for complex digital software models, can also be used to couple hardware with simulators, whereby all advantages of the OMI (e.g. vendor independence, IP protection) are preserved.
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Open Model Forum Home Page, http://www.eda.org/omf
Synopsys Inc.: SWIFT Interface Specification
IEEE P1499 Technical Committee: IEEE P1499-Standard Interface for Hardware Description Models of Electronic Components. IEEE Standard Department
Hobbs, W.: Model Availability, Portability, and Accuracy-An IC Vendor’s Perspective, Effort and Vision for the Future. Computer Simulation, special issue on “Simulation Software Development” (1995) vol. 4, pp. 155–182
Haufe, J., Schwarz, P., Berndt, T., Große, J.: Accelerated Logic Simulation by Using Prototype Boards. Design, Automation and Test in Europe DATE 1998, Paris, 23.–26.2.98, 183–189 (Designer Track)
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© 2000 Springer-Verlag Berlin Heidelberg
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Hatnik, U., Haufe, J., Schwarz, P. (2000). An Innovative Approach to Couple EDA Tools with Recon.gurable Hardware. In: Hartenstein, R.W., Grünbacher, H. (eds) Field-Programmable Logic and Applications: The Roadmap to Reconfigurable Computing. FPL 2000. Lecture Notes in Computer Science, vol 1896. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-44614-1_95
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DOI: https://doi.org/10.1007/3-540-44614-1_95
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