Abstract
This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.
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Knechtel, R., Wiemer, M. & Frömel, J. Wafer level encapsulation of microsystems using glass frit bonding. Microsyst Technol 12, 468–472 (2006). https://doi.org/10.1007/s00542-005-0036-4
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DOI: https://doi.org/10.1007/s00542-005-0036-4