Abstract
Frit glass bonding is a widely used technology for encapsulation of surface micro-machined structures like inertial sensors or gyroscopes on wafer level. Since for sensors in automotive applications, a lifetime of 15–20 years has to be guaranteed for, a reliable lifetime prediction is necessary. Different material parameters have to be known for a lifetime estimation based on stress corrosion cracking, which determines the long-term strength behaviour of most bonded interfaces of microsystems. Parameters needed for lifetime prediction have to describe the material’s resistance against crack propagation (fracture toughness K IC), the stress situation in a micro package and the long-term strength behaviour. Results for fracture toughness investigations presented in this paper were determined by the micro chevron test. The stress situation in a micro package was calculated by a thermo-mechanical Finite Element Analysis. Furthermore the residual stress in the glass layer and the linear thermal expansion coefficient were determined by a crack width measurement in an environmental scanning electron microscope.
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Acknowledgements
The author would like to thank the German Federal Ministry of Education and Research for financial support (contract 16SV1779) and Dr. Maik Wiemer from the Fraunhofer-Institute for Reliability and Microintegration Chemnitz (Germany) for fabrication of the test samples.
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Dresbach, C., Krombholz, A., Ebert, M. et al. Mechanical properties of glass frit bonded micro packages. Microsyst Technol 12, 473–480 (2006). https://doi.org/10.1007/s00542-005-0031-9
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DOI: https://doi.org/10.1007/s00542-005-0031-9